VR2R-0387
① SA Source
- Source: 開啟完整 SA 文章
- Section:
Compute Tray: Thermal - Line hint:
503
Context Before
Source: Nvidia VR NVL72 Component BoM and Power Budget Model ↗
Evidence
Beyond the Strata module, the modules at the front of the Chassis will also have a cold plate module attached. Each Orchid module will have a cold plate module covering the CX-9, the E1.S SSD, the transceiver cages and the various VRMs. The cold plate and the board will be less than 0.5U tall as two Orchid modules are stacked on top of each other in a 1U chassis. Each pair of Orchid modules shares only a pair of QD from the manifold. There will be another set of manifolds that distribute the coolant to the top and the bottom cold plates for the pair of Orchid modules. In our VR NVL72 Component BoM and Power Budget Model ↗ we have the content for all the various thermal components including the cold plate modules, manifolds, and the Quick Disconnects.
Context After
Source: Nvidia VR NVL72 Component BoM and Power Budget Model ↗
② Atomic Claim
cold plate 與 board 的高度都會低於 0.5U，因為 2 個 Orchid modules 會上下堆疊在 1U chassis 中。
- Epistemic Mode:
ASSERTED - Mapping Status:
COMPLETE
③ Semantic Frame
{
"frame_type": "NARY_RELATION",
"participants": [
{
"node": {
"id": "04_knowledge_base/Cold plate",
"label": "cold plate"
},
"role": "cooling_component"
},
{
"node": {
"id": "04_knowledge_base/NVIDIA Orchid Board",
"label": "Orchid module"
},
"role": "board"
}
],
"qualifiers": {
"condition_text": "two Orchid modules stacked in a 1U chassis",
"numeric_mentions": [
"0.5U",
"2",
"1U"
],
"temporal_mentions": []
},
"relation_type": "ORCHID_STACK_HEIGHT_CONSTRAINT"
}④ Canonical Entity Mapping
| Role | Surface Label | Canonical Target |
|---|---|---|
| cooling_component | cold plate | 04_knowledge_base/Cold plate |
| board | Orchid module | 04_knowledge_base/NVIDIA Orchid Board |
⑤ V2 Draft（需要修正時直接編輯）
Inline repair
只編輯以下三個 Draft 區塊。完成後將
review_action設為REQUEST_REPAIR，再手動執行 Repair Preview。
執行腳本前，Draft 不會寫入 Claim Store 或 Graph。
V2 Atomic Claim Draft
cold plate 與 board 的高度都會低於 0.5U，因為 2 個 Orchid modules 會上下堆疊在 1U chassis 中。
V2 Semantic Frame Draft
{
"frame_type": "NARY_RELATION",
"participants": [
{
"node": {
"id": "04_knowledge_base/Cold plate",
"label": "cold plate"
},
"role": "cooling_component"
},
{
"node": {
"id": "04_knowledge_base/NVIDIA Orchid Board",
"label": "Orchid module"
},
"role": "board"
}
],
"qualifiers": {
"condition_text": "two Orchid modules stacked in a 1U chassis",
"numeric_mentions": [
"0.5U",
"2",
"1U"
],
"temporal_mentions": []
},
"relation_type": "ORCHID_STACK_HEIGHT_CONSTRAINT"
}V2 Revision Metadata Draft
{
"epistemic_mode": "ASSERTED",
"mapping_status": "COMPLETE"
}⑥ Human Review
請在 Properties 逐項確認：
- 原文 → Atomic Claim 是否忠實
- Atomic Claim → Semantic Frame 是否忠實
- Canonical Entity mapping 是否正確
- Epistemic mode 是否保留原文語氣
- 最後選擇
review_action
Review state
Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。