VR-COV-VR-TIM1
① SA Source
- Source: 開啟完整 SA 文章
- Section:
Rubin - Line hint:
135
Context Before
Rubin’s chip level TDP increases up to 2,300W vs 1000-1400W for Blackwell. Supply chain rumors have indicated that there are 2 different “SKUs” with different power and performance profiles: a Max-P variant at 2,300W and a Max-Q variant at 1,800W. However, these are not distinct hardware SKUs but the 2 default power profiles that Nvidia is offering users based on their workload needs. Max-Q is what Nvidia believes offers the best performance per Watt. Max-P offers the greatest absolute performance though this would come with an efficiency penalty. Running the Max-P setting results in a 20% increase in rack power draw but the performance gain fall well short of this 20% power consumption increase.
These power profiles are software managed. Users can also choose whatever max power draw they prefer (as long as it is no more than 2,300W per GPU) and this has been the case for previous GPU generations as well. Several hyperscalers and labs have chosen to run their GPUs at lower power to optimize for performance per Watt as well as taking into account power availability constraints.
Evidence
Context After
Source: Nvidia VR NVL72 Component BoM and Power Budget Model ↗
For the mechanical structure of the Rubin package, upgrades have also been made with the addition of an upgraded heat spreader and a stiffener. This compares to Blackwell B200 and B300 packages that only have a heat spreader lid. The heat spreader lid allows more equal distribution of heat exiting the package. It also provides mechanical support for the package to prevent warpage.
② Atomic Claim
The Rubin package illustration labels TIM1 as graphene thin film.
- Epistemic Mode:
ATTRIBUTED - Mapping Status:
COMPLETE
③ Semantic Frame
{
"attribute": "RUBIN_TIM1_MATERIAL",
"context_nodes": [],
"entity": {
"id": "04_knowledge_base/TIM1",
"label": "TIM1"
},
"frame_type": "ATTRIBUTE",
"qualifiers": {
"condition_text": null,
"numeric_mentions": [],
"temporal_mentions": []
},
"value": {
"numeric_mentions": [],
"value_text": "graphene thin film"
}
}④ Canonical Entity Mapping
| Role | Surface Label | Canonical Target |
|---|---|---|
| entity | TIM1 | TIM1 |
⑤ V2 Draft（需要修正時直接編輯）
Inline repair
只編輯以下三個 Draft 區塊。完成後將
review_action設為REQUEST_REPAIR，再手動執行 Repair Preview。
執行腳本前，Draft 不會寫入 Claim Store 或 Graph。
V2 Atomic Claim Draft
The Rubin package illustration labels TIM1 as graphene thin film.
V2 Semantic Frame Draft
{
"attribute": "RUBIN_TIM1_MATERIAL",
"context_nodes": [],
"entity": {
"id": "04_knowledge_base/TIM1",
"label": "TIM1"
},
"frame_type": "ATTRIBUTE",
"qualifiers": {
"condition_text": null,
"numeric_mentions": [],
"temporal_mentions": []
},
"value": {
"numeric_mentions": [],
"value_text": "graphene thin film"
}
}V2 Revision Metadata Draft
{
"epistemic_mode": "ATTRIBUTED",
"mapping_status": "COMPLETE"
}⑥ Human Review
請在 Properties 逐項確認：
- 原文 → Atomic Claim 是否忠實
- Atomic Claim → Semantic Frame 是否忠實
- Canonical Entity mapping 是否正確
- Epistemic mode 是否保留原文語氣
- 最後選擇
review_action
Review state
Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。