VR2R-0391
① SA Source
- Source: 開啟完整 SA 文章
- Section:
Compute Tray: Thermal - Line hint:
509
Context Before
Source: Nvidia VR NVL72 Component BoM and Power Budget Model ↗
Evidence
Previously, cold plates were assembled at the L10 assembly level where the various components are put into place in the chassis. Given the modular approach, the cold plates need to be more tightly integrated with the module itself. Hence, the cold plate will be attached at the L6 assembly level right after the PCBA process. This increases the assembly efficiency as the assembly at L10 is simplified to slotting in the completed modules into the corresponding connectors and quick disconnects.
Context After
Compute Tray: Power Delivery
At the compute tray level, 50VDC power enters the compute tray via the busbar clips at the back of the chassis. Then power travels to the middle of the chassis via the internal busbar cables. From the internal busbar cables, the power path is split into three destinations. The first and second path goes to the left and the right Strata Board, where the internal busbar cable feeds 50VDC power to the Strata Board directly. The third path goes to the power distribution module at the front of the chassis. The internal busbar cables will feed 50VDC power to a busbar device that travels under the PCB midplane to connect to the power distribution board (PDB) on the other side of the PCB midplane. This differs from Grace Blackwell, where 50VDC power goes directly to the PDB. Then, the PDB feeds 12VDC to all the boards in the compute tray.
② Atomic Claim
採用 modular approach 後，cold plates 必須與 module 本體更緊密整合。
- Epistemic Mode:
ASSERTED - Mapping Status:
COMPLETE
③ Semantic Frame
{
"attribute": "MODULAR_INTEGRATION_REQUIREMENT",
"context_nodes": [],
"entity": {
"id": "04_knowledge_base/Cold plate",
"label": "cold plate"
},
"frame_type": "ATTRIBUTE",
"qualifiers": {
"condition_text": "modular approach",
"numeric_mentions": [],
"temporal_mentions": []
},
"value": {
"numeric_mentions": [],
"value_text": "cold plates need tighter integration with the module under the modular approach."
}
}④ Canonical Entity Mapping
| Role | Surface Label | Canonical Target |
|---|---|---|
| entity | cold plate | 04_knowledge_base/Cold plate |
⑤ V2 Draft（需要修正時直接編輯）
Inline repair
只編輯以下三個 Draft 區塊。完成後將
review_action設為REQUEST_REPAIR，再手動執行 Repair Preview。
執行腳本前，Draft 不會寫入 Claim Store 或 Graph。
V2 Atomic Claim Draft
採用 modular approach 後，cold plates 必須與 module 本體更緊密整合。
V2 Semantic Frame Draft
{
"attribute": "MODULAR_INTEGRATION_REQUIREMENT",
"context_nodes": [],
"entity": {
"id": "04_knowledge_base/Cold plate",
"label": "cold plate"
},
"frame_type": "ATTRIBUTE",
"qualifiers": {
"condition_text": "modular approach",
"numeric_mentions": [],
"temporal_mentions": []
},
"value": {
"numeric_mentions": [],
"value_text": "cold plates need tighter integration with the module under the modular approach."
}
}V2 Revision Metadata Draft
{
"epistemic_mode": "ASSERTED",
"mapping_status": "COMPLETE"
}⑥ Human Review
請在 Properties 逐項確認：
- 原文 → Atomic Claim 是否忠實
- Atomic Claim → Semantic Frame 是否忠實
- Canonical Entity mapping 是否正確
- Epistemic mode 是否保留原文語氣
- 最後選擇
review_action
Review state
Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。