VR2R-0111::SPLIT01
① SA Source
- Source: 開啟完整 SA 文章
- Section:
Rubin - Line hint:
139
Context Before
Source: Nvidia VR NVL72 Component BoM and Power Budget Model ↗
Evidence
For the mechanical structure of the Rubin package, upgrades have also been made with the addition of an upgraded heat spreader and a stiffener. This compares to Blackwell B200 and B300 packages that only have a heat spreader lid. The heat spreader lid allows more equal distribution of heat exiting the package. It also provides mechanical support for the package to prevent warpage.
Context After
For Rubin, the heat spreader lid is a module made up of two separate lids. Beside the heat spreader lid, a stiffener is added to the package structure to provide even more mechanical support to avoid warpage. At the surface of the heat spreader lid, there will also be a layer of electroplated gold. The reason for this is to prevent corrosion from liquid metal TIM2, which is between the heat spreader lid and the cold plate.
Vera
② Atomic Claim
The Rubin package mechanical structure adds an upgraded heat spreader.
- Epistemic Mode:
ASSERTED - Mapping Status:
COMPLETE
③ Semantic Frame
{
"attribute": "PACKAGE_HEAT_SPREADER",
"context_nodes": [
{
"id": "04_knowledge_base/封裝",
"label": "package"
}
],
"entity": {
"id": "04_knowledge_base/Vera Rubin",
"label": "Rubin"
},
"frame_type": "ATTRIBUTE",
"qualifiers": {
"condition_text": null,
"numeric_mentions": [],
"temporal_mentions": []
},
"value": {
"numeric_mentions": [],
"value_text": "The Rubin package mechanical structure adds an upgraded heat spreader."
}
}④ Canonical Entity Mapping
| Role | Surface Label | Canonical Target |
|---|---|---|
| entity | Rubin | 04_knowledge_base/Vera Rubin |
| context_0 | package | 04_knowledge_base/封裝 |
⑤ V2 Draft（需要修正時直接編輯）
Inline repair
只編輯以下三個 Draft 區塊。完成後將
review_action設為REQUEST_REPAIR，再手動執行 Repair Preview。
執行腳本前，Draft 不會寫入 Claim Store 或 Graph。
V2 Atomic Claim Draft
The Rubin package mechanical structure adds an upgraded heat spreader.
V2 Semantic Frame Draft
{
"attribute": "PACKAGE_HEAT_SPREADER",
"context_nodes": [
{
"id": "04_knowledge_base/封裝",
"label": "package"
}
],
"entity": {
"id": "04_knowledge_base/Vera Rubin",
"label": "Rubin"
},
"frame_type": "ATTRIBUTE",
"qualifiers": {
"condition_text": null,
"numeric_mentions": [],
"temporal_mentions": []
},
"value": {
"numeric_mentions": [],
"value_text": "The Rubin package mechanical structure adds an upgraded heat spreader."
}
}V2 Revision Metadata Draft
{
"epistemic_mode": "ASSERTED",
"mapping_status": "COMPLETE"
}⑥ Human Review
請在 Properties 逐項確認：
- 原文 → Atomic Claim 是否忠實
- Atomic Claim → Semantic Frame 是否忠實
- Canonical Entity mapping 是否正確
- Epistemic mode 是否保留原文語氣
- 最後選擇
review_action
Review state
Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。