VR2-0117
① SA Source
- Source: 開啟完整 SA 文章
- Section:
Rubin - Line hint:
141
Context Before
Source: Nvidia VR NVL72 Component BoM and Power Budget Model ↗
For the mechanical structure of the Rubin package, upgrades have also been made with the addition of an upgraded heat spreader and a stiffener. This compares to Blackwell B200 and B300 packages that only have a heat spreader lid. The heat spreader lid allows more equal distribution of heat exiting the package. It also provides mechanical support for the package to prevent warpage.
Evidence
At the surface of the heat spreader lid, there will also be a layer of electroplated gold
Context After
Vera
② Atomic Claim
關於 Rubin：Heat spreader lid 表面還會鍍上一層 electroplated gold。
- Epistemic Mode:
ASSERTED - Mapping Status:
PARTIAL
③ Semantic Frame
{
"attribute": "UNSPECIFIED_ATTRIBUTE",
"context_nodes": [],
"entity": {
"id": "04_knowledge_base/Vera Rubin",
"label": "Rubin"
},
"frame_type": "ATTRIBUTE",
"qualifiers": {
"condition_text": null,
"numeric_mentions": [],
"temporal_mentions": []
},
"value": {
"numeric_mentions": [],
"value_text": "關於 Rubin：Heat spreader lid 表面還會鍍上一層 electroplated gold。"
}
}④ Canonical Entity Mapping
| Role | Surface Label | Canonical Target |
|---|---|---|
| entity | Rubin | 04_knowledge_base/Vera Rubin |
⑤ Human Review
請在 Properties 逐項確認：
- 原文 → Atomic Claim 是否忠實
- Atomic Claim → Semantic Frame 是否忠實
- Canonical Entity mapping 是否正確
- Epistemic mode 是否保留原文語氣
- 最後選擇
review_action
Review state
Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。