clm_c78c6be60aa446828866c3e4af148ae1_r1

VR2-0423

① SA Source

• Source: 開啟完整 SA 文章
• Section: Compute Tray: Power Delivery
• Line hint: 513

Context Before

Previously, cold plates were assembled at the L10 assembly level where the various components are put into place in the chassis. Given the modular approach, the cold plates need to be more tightly integrated with the module itself. Hence, the cold plate will be attached at the L6 assembly level right after the PCBA process. This increases the assembly efficiency as the assembly at L10 is simplified to slotting in the completed modules into the corresponding connectors and quick disconnects.

Compute Tray: Power Delivery

Evidence

The internal busbar cables will feed 50VDC power to a busbar device that travels under the PCB midplane to connect to the power distribution board (PDB) on the other side of the PCB midplane

Context After

Source: Nvidia VR NVL72 Component BoM and Power Budget Model ↗

② Atomic Claim

Internal busbar cables 會把 50VDC power 輸送到一個 busbar device；該 device 從 PCB midplane 下方穿過，連接另一側 PCB midplane 上的 power distribution board（PDB）。

• Epistemic Mode: ASSERTED
• Mapping Status: COMPLETE

③ Semantic Frame

{
  "frame_type": "NARY_RELATION",
  "participants": [
    {
      "node": {
        "id": "04_knowledge_base/Busbar",
        "label": "busbar"
      },
      "role": "endpoint_or_system"
    },
    {
      "node": {
        "id": "04_knowledge_base/50VDC",
        "label": "50VDC"
      },
      "role": "connected_entity"
    },
    {
      "node": {
        "id": "04_knowledge_base/PCB",
        "label": "PCB"
      },
      "role": "connected_entity"
    },
    {
      "node": {
        "id": "04_knowledge_base/Midplane",
        "label": "midplane"
      },
      "role": "connected_entity"
    },
    {
      "node": {
        "id": "04_knowledge_base/Power Distribution Board",
        "label": "power distribution board"
      },
      "role": "connected_entity"
    }
  ],
  "qualifiers": {
    "condition_text": null,
    "numeric_mentions": [
      "50"
    ],
    "temporal_mentions": []
  },
  "relation_type": "CONNECTS_TO"
}

④ Canonical Entity Mapping

Role	Surface Label	Canonical Target
endpoint_or_system	busbar	Busbar
connected_entity	50VDC	50VDC
connected_entity	PCB	PCB
connected_entity	midplane	Midplane
connected_entity	power distribution board	04_knowledge_base/Power Distribution Board

⑤ Human Review

請在 Properties 逐項確認：

• 原文 → Atomic Claim 是否忠實
• Atomic Claim → Semantic Frame 是否忠實
• Canonical Entity mapping 是否正確
• Epistemic mode 是否保留原文語氣
• 最後選擇 review_action

Review state

Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。