VR2-0112
① SA Source
- Source: 開啟完整 SA 文章
- Section:
Rubin - Line hint:
139
Context Before
Source: Nvidia VR NVL72 Component BoM and Power Budget Model ↗
Evidence
Context After
For Rubin, the heat spreader lid is a module made up of two separate lids. Beside the heat spreader lid, a stiffener is added to the package structure to provide even more mechanical support to avoid warpage. At the surface of the heat spreader lid, there will also be a layer of electroplated gold. The reason for this is to prevent corrosion from liquid metal TIM2, which is between the heat spreader lid and the cold plate.
Vera
② Atomic Claim
- Epistemic Mode:
ASSERTED - Mapping Status:
PARTIAL
③ Semantic Frame
{
"comparison_expression": "相較之下，Blackwell B200 與 B300 package 僅配置 heat spreader lid。",
"entities": [
{
"id": "04_knowledge_base/Blackwell",
"label": "Blackwell"
},
{
"id": "04_knowledge_base/NVIDIA B200",
"label": "B200"
},
{
"id": "04_knowledge_base/NVIDIA B300",
"label": "B300"
},
{
"id": "04_knowledge_base/封裝",
"label": "package"
}
],
"frame_type": "COMPARISON",
"metric": "UNSPECIFIED_METRIC",
"operator": "COMPARES_WITH",
"qualifiers": {
"condition_text": null,
"numeric_mentions": [],
"temporal_mentions": []
}
}④ Canonical Entity Mapping
| Role | Surface Label | Canonical Target |
|---|---|---|
| comparison_entity_0 | Blackwell | Blackwell |
| comparison_entity_1 | B200 | 04_knowledge_base/NVIDIA B200 |
| comparison_entity_2 | B300 | 04_knowledge_base/NVIDIA B300 |
| comparison_entity_3 | package | 04_knowledge_base/封裝 |
⑤ Human Review
請在 Properties 逐項確認：
- 原文 → Atomic Claim 是否忠實
- Atomic Claim → Semantic Frame 是否忠實
- Canonical Entity mapping 是否正確
- Epistemic mode 是否保留原文語氣
- 最後選擇
review_action
Review state
Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。