clm_9521822968c045ba9a801cd09b7687e8_r1

VR2-0350

① SA Source

• Source: 開啟完整 SA 文章
• Section: PCB Materials Upgrade and Area Growth
• Line hint: 451

Context Before

Source: VR NVL72 Component BoM and Power Budget Model ↗

Evidence

Copper foil is upgraded to HVLP4 across the board for the main compute and networking boards

Context After

The Table below shows the CCL classification and PCB specification of each main board in Blackwell versus Rubin.

② Atomic Claim

主要 compute 與 networking boards 的 Copper foil 全面升級至 HVLP4。

• Epistemic Mode: ASSERTED
• Mapping Status: COMPLETE

③ Semantic Frame

{
  "attribute": "COMPUTE_PERFORMANCE",
  "context_nodes": [
    {
      "id": "04_knowledge_base/HVLP copper foil",
      "label": "HVLP4"
    }
  ],
  "entity": {
    "id": "04_knowledge_base/Copper",
    "label": "Copper"
  },
  "frame_type": "ATTRIBUTE",
  "qualifiers": {
    "condition_text": null,
    "numeric_mentions": [],
    "temporal_mentions": []
  },
  "value": {
    "numeric_mentions": [],
    "value_text": "主要 compute 與 networking boards 的 Copper foil 全面升級至 HVLP4。"
  }
}

④ Canonical Entity Mapping

Role	Surface Label	Canonical Target
entity	Copper	Copper
context_0	HVLP4	04_knowledge_base/HVLP copper foil

⑤ Human Review

請在 Properties 逐項確認：

• 原文 → Atomic Claim 是否忠實
• Atomic Claim → Semantic Frame 是否忠實
• Canonical Entity mapping 是否正確
• Epistemic mode 是否保留原文語氣
• 最後選擇 review_action

Review state

Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。