VR2-0364
① SA Source
- Source: 開啟完整 SA 文章
- Section:
PCB Materials Upgrade and Area Growth - Line hint:
467
Context Before
Source: Panasonic
Copper foil content in Rubin is upgraded from HVLP2 to HVLP4 grade copper foil for the signal layers. As discussed earlier, due to the skin effect, smoother copper foil equals to lower insertion loss. HVLP is the classification of copper foil standing for Ultra-Low Profile Copper Foil. The higher the HVLP grade equals to lower surface roughness.
Evidence
By adding more dedicated power layers, cross talk is reduced as power layers and signal layers are separated
Context After
The glass fiber cloth upgrade aims to reduce the dielectric constant of CCL. Beside glass fiber cloth, resin is also a key factor contributing to dielectric constant. To achieve a desirable dielectric constant, the CCL makers have their unique recipes to their formulation of the two dielectric materials in the CCL. Currently, debate around the CCL spec is around the adoption of Quartz cloth (Q glass).
Quartz cloth is the next generation material that replaces the glass fiber cloth materials as the reinforcing layer, pushing dielectric constant even lower. Besides lower dielectric constant, quartz cloth also has the benefits of being stronger, more temperature resistance, and having a lower CTE. On the other hand, the cost is multiples higher than that of the highest-grade glass fiber cloth and is much harder to process at the PCB manufacturing level, leading to worse yield.
② Atomic Claim
關於 PCB：增加 dedicated power layers 並把 power layers 與 signal layers 分離，可降低 cross-talk。
- Epistemic Mode:
ASSERTED - Mapping Status:
COMPLETE
③ Semantic Frame
{
"attribute": "LAYER_COUNT",
"context_nodes": [],
"entity": {
"id": "04_knowledge_base/PCB",
"label": "PCB"
},
"frame_type": "ATTRIBUTE",
"qualifiers": {
"condition_text": null,
"numeric_mentions": [],
"temporal_mentions": []
},
"value": {
"numeric_mentions": [],
"value_text": "關於 PCB：增加 dedicated power layers 並把 power layers 與 signal layers 分離，可降低 cross-talk。"
}
}④ Canonical Entity Mapping
| Role | Surface Label | Canonical Target |
|---|---|---|
| entity | PCB | PCB |
⑤ Human Review
請在 Properties 逐項確認：
- 原文 → Atomic Claim 是否忠實
- Atomic Claim → Semantic Frame 是否忠實
- Canonical Entity mapping 是否正確
- Epistemic mode 是否保留原文語氣
- 最後選擇
review_action
Review state
Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。