VR2-0361
① SA Source
- Source: 開啟完整 SA 文章
- Section:
PCB Materials Upgrade and Area Growth - Line hint:
465
Context Before
Source: Panasonic
Evidence
HVLP is the classification of copper foil standing for Ultra-Low Profile Copper Foil
Context After
For the power layers, the additional layers in Strata compared to Blackwell are mostly power layers to accommodate more power going into the GPU. By adding more dedicated power layers, cross talk is reduced as power layers and signal layers are separated. Power layer copper foils are much thicker to insulate the current travelling through it.
The glass fiber cloth upgrade aims to reduce the dielectric constant of CCL. Beside glass fiber cloth, resin is also a key factor contributing to dielectric constant. To achieve a desirable dielectric constant, the CCL makers have their unique recipes to their formulation of the two dielectric materials in the CCL. Currently, debate around the CCL spec is around the adoption of Quartz cloth (Q glass).
② Atomic Claim
HVLP 是 copper foil 的分類，代表 Ultra-Low Profile Copper Foil。
- Epistemic Mode:
ASSERTED - Mapping Status:
PARTIAL
③ Semantic Frame
{
"attribute": "UNSPECIFIED_ATTRIBUTE",
"context_nodes": [
{
"id": "04_knowledge_base/HVLP copper foil",
"label": "Ultra-Low Profile Copper Foil"
}
],
"entity": {
"id": "04_knowledge_base/Copper",
"label": "copper"
},
"frame_type": "ATTRIBUTE",
"qualifiers": {
"condition_text": null,
"numeric_mentions": [],
"temporal_mentions": []
},
"value": {
"numeric_mentions": [],
"value_text": "HVLP 是 copper foil 的分類，代表 Ultra-Low Profile Copper Foil。"
}
}④ Canonical Entity Mapping
| Role | Surface Label | Canonical Target |
|---|---|---|
| entity | copper | Copper |
| context_0 | Ultra-Low Profile Copper Foil | 04_knowledge_base/HVLP copper foil |
⑤ Human Review
請在 Properties 逐項確認：
- 原文 → Atomic Claim 是否忠實
- Atomic Claim → Semantic Frame 是否忠實
- Canonical Entity mapping 是否正確
- Epistemic mode 是否保留原文語氣
- 最後選擇
review_action
Review state
Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。