SA260324R-0091_r1

SA260324R-0091

① SA Source

• Source: 開啟完整 SA 文章
• Section: SRAM and Memory Hierarchy
• Line hint: 91

Context Before

One of the technical innovations planned is hybrid bonded DRAM to extend on-chip memory with only a slight decrease in latency and bandwidth vs SRAM, but much higher performance compared to DRAM. SK Hynix was tapped as the supplier of the DRAM to be used for the 3D stacking.

Evidence

All of this and more was detailed long ago in the Accelerator model.

Context After

↗

② Atomic Claim

上述內容以及更多細節，早已在 Accelerator model 中說明。

• Epistemic Mode: ASSERTED
• Mapping Status: PARTIAL

③ Semantic Frame

{
  "frame_type": "CLAIM_ONLY",
  "qualifiers": {
    "condition_text": null,
    "numeric_mentions": [],
    "temporal_mentions": []
  },
  "reason": "META_REFERENCE_TO_PRIOR_ANALYSIS",
  "statement": "上述內容以及更多細節，早已在 Accelerator model 中說明。"
}

④ Canonical Entity Mapping

Role	Surface Label	Canonical Target
—	—	—

⑤ Human Review

請在 Properties 逐項確認：

• 原文 → Atomic Claim 是否忠實
• Atomic Claim → Semantic Frame 是否忠實
• Canonical Entity mapping 是否正確
• Epistemic mode 是否保留原文語氣
• 最後選擇 review_action

Review state

Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。