SA260324R-0090
① SA Source
- Source: 開啟完整 SA 文章
- Section:
SRAM and Memory Hierarchy - Line hint:
91
Context Before
One of the technical innovations planned is hybrid bonded DRAM to extend on-chip memory with only a slight decrease in latency and bandwidth vs SRAM, but much higher performance compared to DRAM.
Evidence
SK Hynix was tapped as the supplier of the DRAM to be used for the 3D stacking.
Context After
All of this and more was detailed long ago in the Accelerator model. ↗
② Atomic Claim
SK Hynix 被選為 3D stacking 所使用 DRAM 的供應商。
- Epistemic Mode:
ASSERTED - Mapping Status:
COMPLETE
③ Semantic Frame
{
"frame_type": "NARY_RELATION",
"participants": [
{
"node": {
"id": "02_companies/000660",
"label": "SK Hynix"
},
"role": "supplier"
},
{
"node": {
"id": "04_knowledge_base/DRAM",
"label": "DRAM"
},
"role": "supplied_entity"
},
{
"node": {
"id": "04_knowledge_base/3D integration",
"label": "3D stacking"
},
"role": "integration_context"
}
],
"qualifiers": {
"condition_text": null,
"numeric_mentions": [],
"temporal_mentions": []
},
"relation_type": "SUPPLIES_MEMORY_FOR_3D_STACKING"
}④ Canonical Entity Mapping
| Role | Surface Label | Canonical Target |
|---|---|---|
| supplier | SK Hynix | 000660 |
| supplied_entity | DRAM | DRAM |
| integration_context | 3D stacking | 04_knowledge_base/3D integration |
⑤ Human Review
請在 Properties 逐項確認：
- 原文 → Atomic Claim 是否忠實
- Atomic Claim → Semantic Frame 是否忠實
- Canonical Entity mapping 是否正確
- Epistemic mode 是否保留原文語氣
- 最後選擇
review_action
Review state
Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。