VR2R-0391
① SA Source
- Source: 開啟完整 SA 文章
- Section:
Compute Tray: Thermal - Line hint:
328
Context Before
Previously, cold plates were assembled at the L10 assembly level where the various components are put into place in the chassis.
Evidence
Given the modular approach, the cold plates need to be more tightly integrated with the module itself.
Context After
Hence, the cold plate will be attached at the L6 assembly level right after the PCBA process. This increases the assembly efficiency as the assembly at L10 is simplified to slotting in the completed modules into the corresponding connectors and quick disconnects.
② Atomic Claim
採用 modular approach 後，cold plates 必須與 module 本體更緊密整合。
- Epistemic Mode:
ASSERTED - Mapping Status:
COMPLETE
③ Semantic Frame
{
"attribute": "MODULAR_INTEGRATION_REQUIREMENT",
"context_nodes": [],
"entity": {
"id": "04_knowledge_base/Cold plate",
"label": "cold plate"
},
"frame_type": "ATTRIBUTE",
"qualifiers": {
"condition_text": "modular approach",
"numeric_mentions": [],
"temporal_mentions": []
},
"value": {
"numeric_mentions": [],
"value_text": "cold plates need tighter integration with the module under the modular approach."
}
}④ Canonical Entity Mapping
| Role | Surface Label | Canonical Target |
|---|---|---|
| entity | cold plate | 04_knowledge_base/Cold plate |
⑤ Human Review
請在 Properties 逐項確認：
- 原文 → Atomic Claim 是否忠實
- Atomic Claim → Semantic Frame 是否忠實
- Canonical Entity mapping 是否正確
- Epistemic mode 是否保留原文語氣
- 最後選擇
review_action
Review state
Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。