VR2R-0389_r1

VR2R-0389

① SA Source

• Source: 開啟完整 SA 文章
• Section: Compute Tray: Thermal
• Line hint: 326

Context Before

Beyond the Strata module, the modules at the front of the chassis will also have a cold plate module attached. Each Orchid module will have a cold plate module covering the CX-9, the E1.S SSD, the transceiver cages and the various VRMs. The cold plate and the board will be less than 0.5U tall as two Orchid modules are stacked on top of each other in a 1U chassis. Each pair of Orchid modules shares only a pair of QD from the manifold.

Evidence

There will be another set of manifolds that distribute the coolant to the top and the bottom cold plates for the pair of Orchid modules.

Context After

Previously, cold plates were assembled at the L10 assembly level where the various components are put into place in the chassis. Given the modular approach, the cold plates need to be more tightly integrated with the module itself. Hence, the cold plate will be attached at the L6 assembly level right after the PCBA process. This increases the assembly efficiency as the assembly at L10 is simplified to slotting in the completed modules into the corresponding connectors and quick disconnects.

② Atomic Claim

另有一組 manifolds，將 coolant 分配到這對 Orchid modules 的上、下 cold plates。

• Epistemic Mode: ASSERTED
• Mapping Status: PARTIAL

③ Semantic Frame

{
  "frame_type": "NARY_RELATION",
  "participants": [
    {
      "node": {
        "id": "04_knowledge_base/NVIDIA Orchid Board",
        "label": "Orchid modules"
      },
      "role": "board_pair"
    },
    {
      "node": {
        "id": "04_knowledge_base/Cold plate",
        "label": "cold plates"
      },
      "role": "cooling_component"
    }
  ],
  "qualifiers": {
    "condition_text": "manifolds are plain text in source claim; top and bottom cold plates",
    "numeric_mentions": [],
    "temporal_mentions": []
  },
  "relation_type": "MANIFOLD_DISTRIBUTES_COOLANT_TO_ORCHID_COLD_PLATES"
}

④ Canonical Entity Mapping

Role	Surface Label	Canonical Target
board_pair	Orchid modules	04_knowledge_base/NVIDIA Orchid Board
cooling_component	cold plates	04_knowledge_base/Cold plate

⑤ Human Review

請在 Properties 逐項確認：

• 原文 → Atomic Claim 是否忠實
• Atomic Claim → Semantic Frame 是否忠實
• Canonical Entity mapping 是否正確
• Epistemic mode 是否保留原文語氣
• 最後選擇 review_action

Review state

Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。