VR2R-0384
① SA Source
- Source: 開啟完整 SA 文章
- Section:
Compute Tray: Thermal - Line hint:
322
Context Before
This increases the surface area and increases the thermal dissipation capacity of the cold plate. Also, there will be a layer of gold plated on the surface contacting the Rubin GPU.
Evidence
The reason for this is to prevent corrosion of the copper from the liquid metal Indium TIM2.
Context After
Beyond the Strata module, the modules at the front of the chassis will also have a cold plate module attached. Each Orchid module will have a cold plate module covering the CX-9, the E1.S SSD, the transceiver cages and the various VRMs. The cold plate and the board will be less than 0.5U tall as two Orchid modules are stacked on top of each other in a 1U chassis. Each pair of Orchid modules shares only a pair of QD from the manifold.
② Atomic Claim
這樣做是為了避免 liquid-metal Indium TIM2 腐蝕 copper。
- Epistemic Mode:
ASSERTED - Mapping Status:
PARTIAL
③ Semantic Frame
{
"frame_type": "CLAIM_ONLY",
"qualifiers": {
"condition_text": "reason for the surface plating in VR2R-0383",
"numeric_mentions": [],
"temporal_mentions": []
},
"reason": "COPPER_INDIUM_TIM2_NOT_CANONICALIZED_IN_SOURCE_CLAIM",
"statement": "the gold-plating step prevents copper corrosion from liquid-metal Indium TIM2."
}④ Canonical Entity Mapping
| Role | Surface Label | Canonical Target |
|---|---|---|
| — | — | — |
⑤ Human Review
請在 Properties 逐項確認：
- 原文 → Atomic Claim 是否忠實
- Atomic Claim → Semantic Frame 是否忠實
- Canonical Entity mapping 是否正確
- Epistemic mode 是否保留原文語氣
- 最後選擇
review_action
Review state
Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。