VR2R-0343
① SA Source
- Source: 開啟完整 SA 文章
- Section:
PCB Materials Upgrade and Area Growth - Line hint:
300
Context Before
Copper foil content in Rubin is upgraded from HVLP2 to HVLP4 grade copper foil for the signal layers. As discussed earlier, due to the skin effect, smoother copper foil equals to lower insertion loss. HVLP is the classification of copper foil standing for Ultra-Low Profile Copper Foil. The higher the HVLP grade equals to lower surface roughness.
Evidence
Context After
By adding more dedicated power layers, cross talk is reduced as power layers and signal layers are separated. Power layer copper foils are much thicker to insulate the current travelling through it.
② Atomic Claim
在 power layers 方面,Strata 相較 Blackwell 增加的 layers 多數是 power layers,用來承載更多送入 GPU 的 power。
- Epistemic Mode:
ASSERTED - Mapping Status:
PARTIAL
③ Semantic Frame
{
"frame_type": "NARY_RELATION",
"participants": [
{
"node": {
"id": "04_knowledge_base/Blackwell",
"label": "Blackwell"
},
"role": "reference_generation"
},
{
"node": {
"id": "04_knowledge_base/GPU",
"label": "GPU"
},
"role": "power_recipient"
}
],
"qualifiers": {
"condition_text": "Strata is plain text in this source claim; added layers are mostly power layers",
"numeric_mentions": [],
"temporal_mentions": []
},
"relation_type": "ADDITIONAL_STRATA_LAYERS_SUPPORT_GPU_POWER"
}④ Canonical Entity Mapping
⑤ Human Review
請在 Properties 逐項確認:
- 原文 → Atomic Claim 是否忠實
- Atomic Claim → Semantic Frame 是否忠實
- Canonical Entity mapping 是否正確
- Epistemic mode 是否保留原文語氣
- 最後選擇
review_action
Review state
Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。