VR2R-0342
① SA Source
- Source: 開啟完整 SA 文章
- Section:
PCB Materials Upgrade and Area Growth - Line hint:
298
Context Before
Copper foil content in Rubin is upgraded from HVLP2 to HVLP4 grade copper foil for the signal layers. As discussed earlier, due to the skin effect, smoother copper foil equals to lower insertion loss. HVLP is the classification of copper foil standing for Ultra-Low Profile Copper Foil.
Evidence
The higher the HVLP grade equals to lower surface roughness.
Context After
For the power layers, the additional layers in Strata compared to Blackwell are mostly power layers to accommodate more power going into the GPU. By adding more dedicated power layers, cross talk is reduced as power layers and signal layers are separated. Power layer copper foils are much thicker to insulate the current travelling through it.
② Atomic Claim
HVLP grade 越高，surface roughness 越低。
- Epistemic Mode:
ASSERTED - Mapping Status:
PARTIAL
③ Semantic Frame
{
"frame_type": "CLAIM_ONLY",
"qualifiers": {
"condition_text": null,
"numeric_mentions": [],
"temporal_mentions": []
},
"reason": "HVLP_AND_SURFACE_ROUGHNESS_NOT_CANONICALIZED_IN_SOURCE_CLAIM",
"statement": "higher HVLP grade corresponds to lower surface roughness."
}④ Canonical Entity Mapping
| Role | Surface Label | Canonical Target |
|---|---|---|
| — | — | — |
⑤ Human Review
請在 Properties 逐項確認：
- 原文 → Atomic Claim 是否忠實
- Atomic Claim → Semantic Frame 是否忠實
- Canonical Entity mapping 是否正確
- Epistemic mode 是否保留原文語氣
- 最後選擇
review_action
Review state
Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。