VR2R-0341_r1

VR2R-0341

① SA Source

• Source: 開啟完整 SA 文章
• Section: PCB Materials Upgrade and Area Growth
• Line hint: 298

Context Before

Copper foil content in Rubin is upgraded from HVLP2 to HVLP4 grade copper foil for the signal layers. As discussed earlier, due to the skin effect, smoother copper foil equals to lower insertion loss.

Evidence

HVLP is the classification of copper foil standing for Ultra-Low Profile Copper Foil.

Context After

The higher the HVLP grade equals to lower surface roughness.

② Atomic Claim

HVLP 是 copper foil 的 classification，代表 Ultra-Low Profile Copper Foil。

• Epistemic Mode: ASSERTED
• Mapping Status: PARTIAL

③ Semantic Frame

{
  "frame_type": "CLAIM_ONLY",
  "qualifiers": {
    "condition_text": "definition claim",
    "numeric_mentions": [],
    "temporal_mentions": []
  },
  "reason": "HVLP_NOT_CANONICALIZED_IN_SOURCE_CLAIM",
  "statement": "HVLP is a copper-foil classification meaning Ultra-Low Profile Copper Foil."
}

④ Canonical Entity Mapping

Role	Surface Label	Canonical Target
—	—	—

⑤ Human Review

請在 Properties 逐項確認：

• 原文 → Atomic Claim 是否忠實
• Atomic Claim → Semantic Frame 是否忠實
• Canonical Entity mapping 是否正確
• Epistemic mode 是否保留原文語氣
• 最後選擇 review_action

Review state

Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。