VR2R-0334
① SA Source
- Source: 開啟完整 SA 文章
- Section:
PCB Materials Upgrade and Area Growth - Line hint:
294
Context Before
On the material side, CCL content upgrades from M7 to M8/M9 drives material upgrades. Copper foil is upgraded to HVLP4 across the board for the main compute and networking boards. A glass fiber cloth upgrade is necessary to reduce dielectric loss, but whether quartz cloth (Q glass) is necessary remains a debate.
Evidence
Below let’s discuss the materials upgrade and the key considerations behind the adoption of each material.
Context After
The classification of CCL materials is determined by its dielectric constant (Dk) and dissipation factor (Df) at a given frequency. Insertion loss is lower at lower Dk and Df value. The common classification is anchored to the Megtron series from Panasonic as they have been setting the industry standard. When people describe the CCL as M7 classification it usually means it matches the same Dk and Df specifications as Megtron 7 of Panasonic.
② Atomic Claim
下文將討論 materials upgrade，以及採用各種 material 背後的主要考量。
- Epistemic Mode:
ASSERTED - Mapping Status:
PARTIAL
③ Semantic Frame
{
"frame_type": "CLAIM_ONLY",
"qualifiers": {
"condition_text": "section transition",
"numeric_mentions": [],
"temporal_mentions": [
"below"
]
},
"reason": "SECTION_TRANSITION_WITHOUT_CANONICAL_ENTITY",
"statement": "the following section discusses material upgrades and adoption considerations for each material."
}④ Canonical Entity Mapping
| Role | Surface Label | Canonical Target |
|---|---|---|
| — | — | — |
⑤ Human Review
請在 Properties 逐項確認：
- 原文 → Atomic Claim 是否忠實
- Atomic Claim → Semantic Frame 是否忠實
- Canonical Entity mapping 是否正確
- Epistemic mode 是否保留原文語氣
- 最後選擇
review_action
Review state
Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。