VR2R-0332_r1

VR2R-0332

① SA Source

• Source: 開啟完整 SA 文章
• Section: PCB Materials Upgrade and Area Growth
• Line hint: 294

Context Before

On the material side, CCL content upgrades from M7 to M8/M9 drives material upgrades. Copper foil is upgraded to HVLP4 across the board for the main compute and networking boards.

Evidence

A glass fiber cloth upgrade is necessary to reduce dielectric loss

Context After

, but whether quartz cloth (Q glass) is necessary remains a debate. Below let’s discuss the materials upgrade and the key considerations behind the adoption of each material.

② Atomic Claim

為降低 dielectric loss，需要升級 glass fiber cloth。

• Epistemic Mode: ASSERTED
• Mapping Status: PARTIAL

③ Semantic Frame

{
  "attribute": "UNSPECIFIED_ATTRIBUTE",
  "context_nodes": [],
  "entity": {
    "id": "04_knowledge_base/高階玻纖布",
    "label": "glass fiber cloth"
  },
  "frame_type": "ATTRIBUTE",
  "qualifiers": {
    "condition_text": null,
    "numeric_mentions": [],
    "temporal_mentions": []
  },
  "value": {
    "numeric_mentions": [],
    "value_text": "為降低 dielectric loss，需要升級 glass fiber cloth。"
  }
}

④ Canonical Entity Mapping

Role	Surface Label	Canonical Target
entity	glass fiber cloth	04_knowledge_base/高階玻纖布

⑤ Human Review

請在 Properties 逐項確認：

• 原文 → Atomic Claim 是否忠實
• Atomic Claim → Semantic Frame 是否忠實
• Canonical Entity mapping 是否正確
• Epistemic mode 是否保留原文語氣
• 最後選擇 review_action

Review state

Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。