VR2R-0331_r1

VR2R-0331

① SA Source

• Source: 開啟完整 SA 文章
• Section: PCB Materials Upgrade and Area Growth
• Line hint: 294

Context Before

On the material side, CCL content upgrades from M7 to M8/M9 drives material upgrades.

Evidence

Copper foil is upgraded to HVLP4 across the board for the main compute and networking boards.

Context After

A glass fiber cloth upgrade is necessary to reduce dielectric loss, but whether quartz cloth (Q glass) is necessary remains a debate. Below let’s discuss the materials upgrade and the key considerations behind the adoption of each material.

② Atomic Claim

主要 compute 與 networking boards 的 copper foil 全面升級到 HVLP4。

• Epistemic Mode: ASSERTED
• Mapping Status: PARTIAL

③ Semantic Frame

{
  "frame_type": "CLAIM_ONLY",
  "qualifiers": {
    "condition_text": null,
    "numeric_mentions": [
      "HVLP4"
    ],
    "temporal_mentions": []
  },
  "reason": "COPPER_FOIL_AND_BOARD_TYPES_NOT_CANONICALIZED_IN_SOURCE_CLAIM",
  "statement": "copper foil is upgraded to HVLP4 across the main compute and networking boards."
}

④ Canonical Entity Mapping

Role	Surface Label	Canonical Target
—	—	—

⑤ Human Review

請在 Properties 逐項確認：

• 原文 → Atomic Claim 是否忠實
• Atomic Claim → Semantic Frame 是否忠實
• Canonical Entity mapping 是否正確
• Epistemic mode 是否保留原文語氣
• 最後選擇 review_action

Review state

Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。