VR2R-0309

① SA Source

Context Before

Dielectric loss is driven by the energy absorption nature of the dielectric materials. Dielectric materials, resins and glass fiber cloth, provide insulation and mechanical reinforcement function for the PCB traces. At high frequency, high-speed signal doesn’t simply travel through the copper traces, the signal travels as an electromagnetic wave with electric field extending into the dielectric materials.

Evidence

As the signal propagates, the dielectric absorbs a portion of the energy and dissipates as heat, contributing to insertion loss.

Context After

Dielectric loss scales with frequency, hence dielectric loss is a dominant limiter of signal performance of long reach PCB traces.

② Atomic Claim

Signal 傳播時,dielectric 會吸收部分能量並以熱的形式耗散,進而造成 insertion loss。

  • Epistemic Mode: ASSERTED
  • Mapping Status: PARTIAL

③ Semantic Frame

{
  "frame_type": "CLAIM_ONLY",
  "qualifiers": {
    "condition_text": null,
    "numeric_mentions": [],
    "temporal_mentions": []
  },
  "reason": "DIELECTRIC_AND_INSERTION_LOSS_NOT_CANONICALIZED_IN_SOURCE_CLAIM",
  "statement": "the dielectric absorbs part of signal energy and dissipates it as heat, contributing to insertion loss."
}

④ Canonical Entity Mapping

RoleSurface LabelCanonical Target
———

⑤ Human Review

請在 Properties 逐項確認:

  • 原文 → Atomic Claim 是否忠實
  • Atomic Claim → Semantic Frame 是否忠實
  • Canonical Entity mapping 是否正確
  • Epistemic mode 是否保留原文語氣
  • 最後選擇 review_action

Review state

Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。