VR2R-0113_r1

VR2R-0113

① SA Source

• Source: 開啟完整 SA 文章
• Section: Rubin
• Line hint: 91

Context Before

For the mechanical structure of the Rubin package, upgrades have also been made with the addition of an upgraded heat spreader and a stiffener. This compares to Blackwell B200 and

Evidence

B300 packages that only have a heat spreader lid.

Context After

The heat spreader lid allows more equal distribution of heat exiting the package. It also provides mechanical support for the package to prevent warpage.

② Atomic Claim

……B300 packages 只有 heat spreader lid。

• Epistemic Mode: ASSERTED
• Mapping Status: PARTIAL

③ Semantic Frame

{
  "attribute": "PACKAGE_HEAT_SPREADER_CONFIGURATION",
  "context_nodes": [],
  "entity": {
    "id": "04_knowledge_base/NVIDIA B300",
    "label": "B300"
  },
  "frame_type": "ATTRIBUTE",
  "qualifiers": {
    "condition_text": "承接 VR2R-0112；heat spreader lid 未 canonicalized",
    "numeric_mentions": [],
    "temporal_mentions": []
  },
  "value": {
    "numeric_mentions": [],
    "value_text": "package only has a heat spreader lid。"
  }
}

④ Canonical Entity Mapping

Role	Surface Label	Canonical Target
entity	B300	04_knowledge_base/NVIDIA B300

⑤ Human Review

請在 Properties 逐項確認：

• 原文 → Atomic Claim 是否忠實
• Atomic Claim → Semantic Frame 是否忠實
• Canonical Entity mapping 是否正確
• Epistemic mode 是否保留原文語氣
• 最後選擇 review_action

Review state

Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。