2025-08-12_scaling-the-memory-wall-the-rise-and-roadmap-of-hbm::HBM25-0031
① SA Source
- Source: 開啟完整 SA 文章
- Section:
Custom Base Die - Line hint:
285
Context Before
First, the base die will move to a modern logic process. Samsung can manufacture this with their logic/foundry capability, but this is beyond what the pure memory manufacturers like Hynix and Micron can do internally, so this will be manufactured by TSMC. TSMC has confirmed there will be 2 variations of the HBM4 base die, one manufactured on N12 and one on N3, this would offer a significant power reduction compared to existing implementations (though a very small reduction in overall power budget of the system). Hynix and Micron also do not have leading edge logic design capability, so they will need the help of advanced logic design houses or IP vendors to contribute to these designs.
More of the area of the base die can be utilized to add in significant functionality with various custom base die configurations. Tying this back to the discussion on the importance of shoreline -** there is a huge amount of untapped shoreline real estate that exists on the HBM base die of today which is going to be unleashed from HBM4 onwards.**
Evidence
Context After
We believe these custom base die implementations will provide 3 main functions: memory controller offload, shoreline expansion, and compute in base die. Let’s examine the possibilities.
Getting Down to the Wire: Better PHYs
② Atomic Claim
SemiAnalysis 預期 Nvidia 與 AMD 會從 HBM4 導入 custom HBM，其他 accelerator designers 可能到 2027 HBM4E 才導入 custom base die。
- Epistemic Mode:
EXPECTED - Mapping Status:
COMPLETE
③ Semantic Frame
{
"frame_type": "NARY_RELATION",
"participants": [
{
"node": {
"id": "02_companies/NVDA",
"label": "Nvidia"
},
"role": "vendor"
},
{
"node": {
"id": "02_companies/AMD",
"label": "AMD"
},
"role": "vendor"
},
{
"node": {
"id": "04_knowledge_base/HBM4",
"label": "HBM4"
},
"role": "memory"
},
{
"node": {
"id": "04_knowledge_base/Custom Base Die",
"label": "Custom Base Die"
},
"role": "base_die"
},
{
"node": {
"id": "04_knowledge_base/HBM4E",
"label": "HBM4E"
},
"role": "later_memory"
}
],
"qualifiers": {
"condition_text": null,
"numeric_mentions": [
"2027"
],
"temporal_mentions": []
},
"relation_type": "CUSTOM_HBM_ADOPTION_TIMELINE"
}④ Canonical Entity Mapping
| Role | Surface Label | Canonical Target |
|---|---|---|
| vendor | Nvidia | NVDA |
| vendor | AMD | AMD |
| memory | HBM4 | HBM4 |
| base_die | Custom Base Die | 04_knowledge_base/Custom Base Die |
| later_memory | HBM4E | HBM4E |
⑤ Human Review
請在 Properties 逐項確認：
- 原文 → Atomic Claim 是否忠實
- Atomic Claim → Semantic Frame 是否忠實
- Canonical Entity mapping 是否正確
- Epistemic mode 是否保留原文語氣
- 最後選擇
review_action
Review state
Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。