2025-08-12_scaling-the-memory-wall-the-rise-and-roadmap-of-hbm::HBM25-0029
① SA Source
- Source: 開啟完整 SA 文章
- Section:
Custom Base Die - Line hint:
281
Context Before
Hynix’s HBM3E base die. Source: SK Hynix
Evidence
First, the base die will move to a modern logic process. Samsung can manufacture this with their logic/foundry capability, but this is beyond what the pure memory manufacturers like Hynix and Micron can do internally, so this will be manufactured by TSMC.
Context After
More of the area of the base die can be utilized to add in significant functionality with various custom base die configurations. Tying this back to the discussion on the importance of shoreline -** there is a huge amount of untapped shoreline real estate that exists on the HBM base die of today which is going to be unleashed from HBM4 onwards.**
We expect Nvidia and AMD to come out with their custom HBM implementations with HBM4, with other accelerator designers likely to only have a custom base die implementation by HBM4E in the 2027 timeframe.
② Atomic Claim
HBM4 base die 將轉向 modern logic process；Hynix/Micron 需依賴外部 foundry，SemiAnalysis 指向 TSMC。
- Epistemic Mode:
EXPECTED - Mapping Status:
COMPLETE
③ Semantic Frame
{
"frame_type": "NARY_RELATION",
"participants": [
{
"node": {
"id": "04_knowledge_base/HBM4",
"label": "HBM4"
},
"role": "memory"
},
{
"node": {
"id": "04_knowledge_base/Logic Process",
"label": "Logic Process"
},
"role": "process"
},
{
"node": {
"id": "02_companies/2330 台積電",
"label": "TSMC"
},
"role": "foundry"
},
{
"node": {
"id": "02_companies/000660",
"label": "Hynix"
},
"role": "memory_vendor"
},
{
"node": {
"id": "02_companies/MU",
"label": "Micron"
},
"role": "memory_vendor"
}
],
"qualifiers": {
"condition_text": null,
"numeric_mentions": [],
"temporal_mentions": []
},
"relation_type": "HBM4_BASE_DIE_FOUNDRY_MODEL"
}④ Canonical Entity Mapping
| Role | Surface Label | Canonical Target |
|---|---|---|
| memory | HBM4 | HBM4 |
| process | Logic Process | 04_knowledge_base/Logic Process |
| foundry | TSMC | 02_companies/2330 台積電 |
| memory_vendor | Hynix | 000660 |
| memory_vendor | Micron | MU |
⑤ Human Review
請在 Properties 逐項確認：
- 原文 → Atomic Claim 是否忠實
- Atomic Claim → Semantic Frame 是否忠實
- Canonical Entity mapping 是否正確
- Epistemic mode 是否保留原文語氣
- 最後選擇
review_action
Review state
Markdown 內文不是正式 approval。只有 Apply bridge 寫入的 Decision Ledger event 才是正式決策。