2026-04-15_isscc-2026-nvidia-and-broadcom-cpo

  • Source: 2026-04-15_isscc-2026-nvidia-and-broadcom-cpo
  • Link occurrences: 881
  • Canonical targets: 174
  • Missing targets: 0
  • Audit batches: 202608100347190800, 202608102114020800, 202608111353240800, 202608112109350800, 202608112133330800, 202608120125230800

Canonical Target Counts

TargetOccurrences
02_companies/2330 台積電43
04_knowledge_base/LPDDR635
02_companies/00066034
04_knowledge_base/HBM427
02_companies/INTC25
04_knowledge_base/DRAM25
02_companies/AMD24
04_knowledge_base/Die-to-die interconnect24
02_companies/MSFT20
04_knowledge_base/HBM18
02_companies/COHR17
02_companies/Rebellions17
02_companies/MediaTek16
04_knowledge_base/CPO15
02_companies/NVDA15
04_knowledge_base/HBM3E15
04_knowledge_base/GDDR715
04_knowledge_base/Maia20012
04_knowledge_base/MRAM12
04_knowledge_base/UCIe12
02_companies/Marvell11
04_knowledge_base/NAND Flash10
02_companies/AVGO10
04_knowledge_base/Transistor10
04_knowledge_base/封裝9
02_companies/LITE9
04_knowledge_base/MI355X8
02_companies/SanDisk8
04_knowledge_base/Rebel1008
04_knowledge_base/Optical Engine8
04_knowledge_base/OCI MSA8
04_knowledge_base/M3DProc8
04_knowledge_base/SRAM8
04_knowledge_base/CPU8
02_companies/Kioxia7
04_knowledge_base/SF47
04_knowledge_base/Samsung SF27
04_knowledge_base/Temperature sensor7
04_knowledge_base/I-CubeS7
03_industries/Foundry7
04_knowledge_base/CoWoS6
04_knowledge_base/TSV6
04_knowledge_base/AI Accelerator6
04_knowledge_base/PMBIST6
04_knowledge_base/LPDDR5X6
04_knowledge_base/TSMC N3P6
04_knowledge_base/TSMC N3E6
04_knowledge_base/400G6
04_knowledge_base/Time-to-Digital Converter5
04_knowledge_base/tCCDR5
02_companies/Together AI5
04_knowledge_base/BiCS105
04_knowledge_base/DWDM5
04_knowledge_base/基板4
04_knowledge_base/ASIC4
04_knowledge_base/GPU4
04_knowledge_base/Vertical Channel Transistor4
04_knowledge_base/SerDes4
02_companies/Switch4
04_knowledge_base/MI300X4
04_knowledge_base/Hybrid Bonding4
04_knowledge_base/Interposer4
04_knowledge_base/JEDEC4
04_knowledge_base/Chiplet architecture4
04_knowledge_base/NRZ4
04_knowledge_base/XCD4
04_knowledge_base/PMOS4
04_knowledge_base/NMOS4
04_knowledge_base/Capacitor4
04_knowledge_base/EMIB3
04_knowledge_base/LPDDR3
04_knowledge_base/PAM43
04_knowledge_base/COUPE3
04_knowledge_base/MBIST3
04_knowledge_base/Tomahawk 53
04_knowledge_base/Intel 18A3
04_knowledge_base/Digital Signal Processor3
04_knowledge_base/Foveros Direct3
04_knowledge_base/SemiAnalysis Memory Model3
04_knowledge_base/eDTC3
04_knowledge_base/Intel Diamond Rapids3
04_knowledge_base/200G3
04_knowledge_base/RDQS3
04_knowledge_base/Wordline3
04_knowledge_base/SoC2
04_knowledge_base/RDL2
04_knowledge_base/Flash memory2
04_knowledge_base/Fiber interconnect2
02_companies/eSilicon2
02_companies/ABBN.SW2
02_companies/Cadence Design Systems2
04_knowledge_base/DR Optics2
04_knowledge_base/PDK2
02_companies/Preferred Networks2
02_companies/Baidu2
04_knowledge_base/Samsung 5LPE2
04_knowledge_base/Process node2
04_knowledge_base/BJT2
04_knowledge_base/Transistor Density2
04_knowledge_base/HBM22
04_knowledge_base/VDDQ2
04_knowledge_base/Reticle2
04_knowledge_base/Cell-on-Peripheral2
04_knowledge_base/DDR2
04_knowledge_base/Microsoft Maia 1002
04_knowledge_base/CMOS2
04_knowledge_base/Bitline2
02_companies/MU1
02_companies/0059301
04_knowledge_base/800G1
02_companies/2454 聯發科1
04_knowledge_base/PIC1
04_knowledge_base/矽電容1
04_knowledge_base/Vera Rubin1
03_industries/光通訊產業1
02_companies/Lambda1
02_companies/CEG1
04_knowledge_base/Clearwater Forest1
04_knowledge_base/Datacenter CPU1
04_knowledge_base/System-in-Package (SiP)1
04_knowledge_base/On-board optics1
04_knowledge_base/Contacted Gate Pitch1
04_knowledge_base/Hybrid Bonding Interconnect1
04_knowledge_base/SF4X1
04_knowledge_base/FEOL1
04_knowledge_base/Quad-Level Cell1
04_knowledge_base/H2001
04_knowledge_base/Ethernet1
04_knowledge_base/Electrical Integrated Circuit (EIC)1
04_knowledge_base/Zen 4c1
04_knowledge_base/FP81
04_knowledge_base/Groq LPX1
04_knowledge_base/Edge-Triggered Transceiver1
04_knowledge_base/Microsoft Azure1
04_knowledge_base/Scale-out networking1
04_knowledge_base/Chip-on-Wafer1
04_knowledge_base/H1001
04_knowledge_base/FP41
04_knowledge_base/Mesh architecture1
04_knowledge_base/Known Good Die1
04_knowledge_base/AMD EPYC Genoa1
04_knowledge_base/Microsoft Cobalt 2001
04_knowledge_base/Silicon photonics1
04_knowledge_base/Scale-up network1
04_knowledge_base/Triple-Level Cell1
04_knowledge_base/Llama1
04_knowledge_base/CPX High-Density Interconnect Paradigm1
04_knowledge_base/C-Band1
04_knowledge_base/Semiconductor Fab1
04_knowledge_base/FP161
04_knowledge_base/Sense Amplifier1
04_knowledge_base/tCCDS1
04_knowledge_base/L2 cache1
04_knowledge_base/Logic Process1
04_knowledge_base/3nm1
04_knowledge_base/100G1
04_knowledge_base/Network Topology1
04_knowledge_base/Active Local Silicon Interconnect1
04_knowledge_base/Known Good Stack1
04_knowledge_base/Xeon1
04_knowledge_base/Ring oscillator1
04_knowledge_base/Scale-Up Optics1
04_knowledge_base/JEDEC HBM41
04_knowledge_base/Bump pitch1
04_knowledge_base/Zen 41
04_knowledge_base/Flip-Flop1
04_knowledge_base/Known Good Package1
04_knowledge_base/BEOL1
04_knowledge_base/Granite Rapids1
04_knowledge_base/Standard cell1
04_knowledge_base/MXFP41
04_knowledge_base/Peri-Under-Cell1
04_knowledge_base/Power Delivery Network1
04_knowledge_base/AMD EPYC Bergamo1