| 02_companies/NVDA | 133 |
| 04_knowledge_base/VR NVL72 | 119 |
| 02_companies/Switch | 95 |
| 04_knowledge_base/GPU | 85 |
| 04_knowledge_base/Compute Tray | 50 |
| 04_knowledge_base/PCB | 45 |
| 04_knowledge_base/Blackwell | 41 |
| 04_knowledge_base/NVLink | 36 |
| 04_knowledge_base/GB200 | 33 |
| 04_knowledge_base/Copper | 31 |
| 04_knowledge_base/BlueField-4 | 27 |
| 04_knowledge_base/Vera Rubin | 26 |
| 04_knowledge_base/800G | 25 |
| 04_knowledge_base/Cold plate | 22 |
| 04_knowledge_base/CPO | 21 |
| 04_knowledge_base/1.6T | 21 |
| 04_knowledge_base/NVIDIA Grace | 21 |
| 04_knowledge_base/GB300 | 21 |
| 04_knowledge_base/Hyperscaler | 20 |
| 04_knowledge_base/FP4 | 20 |
| 04_knowledge_base/CPU | 20 |
| 04_knowledge_base/SerDes | 18 |
| 04_knowledge_base/NIC | 18 |
| 04_knowledge_base/Midplane | 18 |
| 04_knowledge_base/PCIe | 17 |
| 04_knowledge_base/Busbar | 17 |
| 04_knowledge_base/Fiber interconnect | 16 |
| 04_knowledge_base/ASIC | 15 |
| 04_knowledge_base/Insertion loss | 14 |
| 04_knowledge_base/HBM | 13 |
| 02_companies/AMD | 13 |
| 04_knowledge_base/CPX High-Density Interconnect Paradigm | 13 |
| 04_knowledge_base/Copper-clad laminate | 13 |
| 04_knowledge_base/SN6800 | 13 |
| 04_knowledge_base/Backplane | 13 |
| 04_knowledge_base/MI400 | 12 |
| 04_knowledge_base/Ethernet | 12 |
| 04_knowledge_base/OSFP (Octal Small Form-factor Pluggable) | 12 |
| 04_knowledge_base/InfiniBand | 11 |
| 04_knowledge_base/50VDC | 11 |
| 04_knowledge_base/HGX | 10 |
| 04_knowledge_base/Sparsity | 10 |
| 04_knowledge_base/ConnectX-9 | 10 |
| 04_knowledge_base/NVIDIA Oberon | 10 |
| 04_knowledge_base/Quantum X800 | 10 |
| 04_knowledge_base/200G | 10 |
| 04_knowledge_base/Coolant Distribution Unit (CDU) | 9 |
| 04_knowledge_base/Paladin connector | 9 |
| 04_knowledge_base/NVIDIA Strata Board | 9 |
| 04_knowledge_base/DRAM | 8 |
| 04_knowledge_base/NVLink5 | 8 |
| 04_knowledge_base/Reference Design | 8 |
| 04_knowledge_base/Decode | 8 |
| 04_knowledge_base/Chiller | 8 |
| 02_companies/META | 7 |
| 04_knowledge_base/SOCAMM | 7 |
| 04_knowledge_base/NVMe | 7 |
| 02_companies/Groq | 7 |
| 04_knowledge_base/Scale-out networking | 7 |
| 04_knowledge_base/Quick Disconnect | 7 |
| 04_knowledge_base/BlueField-3 | 7 |
| 04_knowledge_base/NVIDIA B300 | 7 |
| 04_knowledge_base/Prefill | 7 |
| 04_knowledge_base/Cableless Design | 7 |
| 04_knowledge_base/DDR5 | 6 |
| 04_knowledge_base/液冷散熱 | 6 |
| 02_companies/APH | 6 |
| 04_knowledge_base/Active electrical cable | 6 |
| 04_knowledge_base/FP8 | 6 |
| 04_knowledge_base/ConnectX-8 | 6 |
| 04_knowledge_base/Flyover cable | 6 |
| 04_knowledge_base/400G | 6 |
| 02_companies/MU | 5 |
| 03_industries/Neocloud產業 | 5 |
| 02_companies/Delta Electronics | 5 |
| 04_knowledge_base/Board-to-board connectors | 5 |
| 04_knowledge_base/Groq LPU | 5 |
| 04_knowledge_base/KV cache | 5 |
| 04_knowledge_base/Capacitor Backup Unit (CBU) | 5 |
| 04_knowledge_base/Quartz cloth | 5 |
| 04_knowledge_base/Chiplet architecture | 5 |
| 04_knowledge_base/Power Density | 5 |
| 04_knowledge_base/Spectrum 6600 | 5 |
| 04_knowledge_base/PSU | 4 |
| 04_knowledge_base/HBM4 | 4 |
| 04_knowledge_base/LPDDR5 | 4 |
| 04_knowledge_base/Multi-plane network architecture | 4 |
| 04_knowledge_base/Optical Engine | 4 |
| 04_knowledge_base/BBU | 4 |
| 04_knowledge_base/SN6810 | 4 |
| 04_knowledge_base/NVL8 | 4 |
| 04_knowledge_base/Bianca Board | 4 |
| 02_companies/2317 鴻海 | 3 |
| 02_companies/6752 | 3 |
| 02_companies/000660 | 3 |
| 04_knowledge_base/Datacenter power shelf | 3 |
| 02_companies/HPE | 3 |
| 04_knowledge_base/NVIDIA Orchid Board | 3 |
| 04_knowledge_base/High-voltage direct current (HVDC) | 3 |
| 04_knowledge_base/Technology Cooling System | 3 |
| 02_companies/Arista | 3 |
| 04_knowledge_base/SemiAnalysis Memory Model | 3 |
| 04_knowledge_base/Scale-up network | 3 |
| 02_companies/CoolIT | 3 |
| 04_knowledge_base/Tomahawk 6 | 3 |
| 04_knowledge_base/Minipack-4 | 3 |
| 04_knowledge_base/HVLP copper foil | 3 |
| 04_knowledge_base/InferenceX | 3 |
| 04_knowledge_base/800VDC | 3 |
| 04_knowledge_base/SSD | 3 |
| 04_knowledge_base/Via | 3 |
| 04_knowledge_base/12V | 3 |
| 04_knowledge_base/GB200 NVL72 | 3 |
| 04_knowledge_base/Pump | 3 |
| 04_knowledge_base/BMC | 2 |
| 02_companies/2382 廣達 | 2 |
| 04_knowledge_base/DCDC | 2 |
| 04_knowledge_base/封裝 | 2 |
| 02_companies/CRWV | 2 |
| 04_knowledge_base/LPDDR | 2 |
| 04_knowledge_base/LVDC | 2 |
| 04_knowledge_base/PCBA | 2 |
| 02_companies/CSCO | 2 |
| 04_knowledge_base/Quantization | 2 |
| 04_knowledge_base/Spectrum-6 | 2 |
| 04_knowledge_base/NVIDIA Rubin adaptive compression | 2 |
| 02_companies/Amazon | 2 |
| 04_knowledge_base/Liquid-to-Air Cooling | 2 |
| 02_companies/Wistron | 2 |
| 04_knowledge_base/Transformer Engine | 2 |
| 04_knowledge_base/LPDDR5X | 2 |
| 04_knowledge_base/Tensor Core | 2 |
| 04_knowledge_base/Echo cancellation | 2 |
| 04_knowledge_base/Chip-to-Chip Interconnect | 2 |
| 04_knowledge_base/NVSwitch | 2 |
| 04_knowledge_base/Liquid-to-liquid cooling | 2 |
| 02_companies/Lenovo | 2 |
| 04_knowledge_base/2-of-4 Sparsity | 2 |
| 04_knowledge_base/GDDR7 | 2 |
| 04_knowledge_base/NVLink-C2C | 2 |
| 02_companies/Together AI | 2 |
| 04_knowledge_base/Optical transceiver | 2 |
| 04_knowledge_base/VRM | 2 |
| 04_knowledge_base/Air-cooled chiller | 2 |
| 04_knowledge_base/Reticle | 2 |
| 04_knowledge_base/TFLOPS | 2 |
| 04_knowledge_base/Air cooling | 2 |
| 04_knowledge_base/GDDR | 2 |
| 04_knowledge_base/Transistor | 2 |
| 04_knowledge_base/NVIDIA B200 | 2 |
| 04_knowledge_base/ConnectX-7 | 2 |
| 04_knowledge_base/Direct Current | 2 |
| 04_knowledge_base/Warpage | 2 |
| 04_knowledge_base/BF16 | 2 |
| 04_knowledge_base/Dry cooler | 2 |
| 04_knowledge_base/TF32 | 2 |
| 04_knowledge_base/3nm | 2 |
| 04_knowledge_base/GB300 NVL72 | 2 |
| 04_knowledge_base/Sequence length | 2 |
| 04_knowledge_base/High Voltage | 2 |
| 04_knowledge_base/高階玻纖布 | 1 |
| 04_knowledge_base/高階CCL | 1 |
| 02_companies/SMCI | 1 |
| 02_companies/MSFT | 1 |
| 02_companies/005930 | 1 |
| 04_knowledge_base/基板 | 1 |
| 04_knowledge_base/TPU | 1 |
| 02_companies/GOOG | 1 |
| 04_knowledge_base/ELS | 1 |
| 04_knowledge_base/M9等級樹脂 | 1 |
| 04_knowledge_base/ABF | 1 |
| 04_knowledge_base/光纖 | 1 |
| 04_knowledge_base/PD | 1 |
| 02_companies/AVGO | 1 |
| 04_knowledge_base/Trn3 | 1 |
| 04_knowledge_base/LTA | 1 |
| 03_industries/光通訊產業 | 1 |
| 02_companies/2308 台達電 | 1 |
| 04_knowledge_base/通用型伺服器 | 1 |
| 04_knowledge_base/HBM3E | 1 |
| 02_companies/DeepSeek | 1 |
| 02_companies/Lambda | 1 |
| 04_knowledge_base/PAM4 | 1 |
| 04_knowledge_base/Intermediate Bus Converter (IBC) Module | 1 |
| 02_companies/Johnson Controls | 1 |
| 04_knowledge_base/Datacenter white-space and gray-space architecture | 1 |
| 04_knowledge_base/AMD MI450X | 1 |
| 02_companies/ALGM | 1 |
| 04_knowledge_base/Tokenomics Model | 1 |
| 04_knowledge_base/MI355 | 1 |
| 04_knowledge_base/Spacecraft Radiators | 1 |
| 04_knowledge_base/Optical circulator | 1 |
| 04_knowledge_base/MI355X | 1 |
| 02_companies/Evapco | 1 |
| 02_companies/Arm Holdings | 1 |
| 02_companies/SPXC | 1 |
| 04_knowledge_base/Solid-State Transformer | 1 |
| 02_companies/PH | 1 |
| 02_companies/Boyd Corporation | 1 |
| 04_knowledge_base/OCP MGX rack-level liquid-cooling specification | 1 |
| 02_companies/Auras Technology | 1 |
| 02_companies/WEKA | 1 |
| 04_knowledge_base/Digital Signal Processor | 1 |
| 02_companies/xAI | 1 |
| 02_companies/TE Connectivity | 1 |
| 04_knowledge_base/Micro-channel cold plate | 1 |
| 04_knowledge_base/RDMA | 1 |
| 02_companies/Credo Technology | 1 |
| 04_knowledge_base/Die-to-die interconnect | 1 |
| 02_companies/CARR | 1 |
| 04_knowledge_base/Non-Scheduled Fabric (NSF) | 1 |
| 02_companies/TT | 1 |
| 04_knowledge_base/Minipack-3 | 1 |
| 04_knowledge_base/H100 | 1 |
| 04_knowledge_base/JEDEC | 1 |
| 04_knowledge_base/Tapeout | 1 |
| 02_companies/VAST Data | 1 |
| 02_companies/Baltimore Aircoil Company | 1 |
| 04_knowledge_base/SRAM | 1 |
| 02_companies/DELL | 1 |
| 04_knowledge_base/Nitro | 1 |
| 04_knowledge_base/SMT | 1 |
| 04_knowledge_base/Superposition | 1 |
| 04_knowledge_base/Pluggable optics | 1 |
| 04_knowledge_base/MCIO | 1 |
| 04_knowledge_base/DGX | 1 |
| 04_knowledge_base/FP16 | 1 |
| 04_knowledge_base/TPUv7 | 1 |
| 04_knowledge_base/Model FLOPS Utilization | 1 |
| 04_knowledge_base/Contact | 1 |
| 04_knowledge_base/VR200 | 1 |
| 04_knowledge_base/CDNA4 | 1 |
| 04_knowledge_base/400VDC | 1 |
| 04_knowledge_base/Pluggable transceiver | 1 |
| 04_knowledge_base/DDR | 1 |
| 04_knowledge_base/100G | 1 |
| 04_knowledge_base/Teralynx | 1 |
| 04_knowledge_base/MXFP6 | 1 |
| 04_knowledge_base/Capacitor | 1 |
| 04_knowledge_base/Inference Context Memory Storage | 1 |
| 04_knowledge_base/MXFP4 | 1 |
| 04_knowledge_base/DR4 | 1 |
| 04_knowledge_base/VR NVL144 | 1 |
| 04_knowledge_base/Power Distribution Board | 1 |
| 04_knowledge_base/BlueField | 1 |
| 04_knowledge_base/MXFP8 | 1 |
| 04_knowledge_base/L3 cache | 1 |
| 04_knowledge_base/Trusted Platform Module | 1 |
| 04_knowledge_base/Compute Tray Topology | 1 |