2025-04-16_huawei-ai-cloudmatrix-384-chinas-answer-to-nvidia-gb200-nvl72
Canonical Target Counts
| Target | Occurrences |
|---|
| 04_knowledge_base/GPU | 22 |
| 02_companies/Huawei | 22 |
| 04_knowledge_base/HBM | 16 |
| 04_knowledge_base/Huawei Ascend | 14 |
| 04_knowledge_base/400G | 12 |
| 02_companies/NVDA | 11 |
| 02_companies/2330 台積電 | 8 |
| 02_companies/SMIC | 6 |
| 04_knowledge_base/CloudMatrix 384 | 6 |
| 04_knowledge_base/GB200 NVL72 | 5 |
| 02_companies/Switch | 4 |
| 04_knowledge_base/矽晶圓 | 4 |
| 04_knowledge_base/Scale-up network | 3 |
| 02_companies/CXMT | 3 |
| 04_knowledge_base/7nm | 3 |
| 04_knowledge_base/Optical transceiver | 3 |
| 04_knowledge_base/SR8 | 3 |
| 04_knowledge_base/LPO | 2 |
| 04_knowledge_base/Scale-out networking | 2 |
| 04_knowledge_base/Copper | 2 |
| 04_knowledge_base/FLOP | 2 |
| 02_companies/Together AI | 1 |
| 02_companies/AVGO | 1 |
| 04_knowledge_base/基板 | 1 |
| 04_knowledge_base/H100 | 1 |
| 02_companies/Arista | 1 |
| 04_knowledge_base/NVLink | 1 |
| 04_knowledge_base/Fault tolerance | 1 |
| 04_knowledge_base/Ramon3 | 1 |
| 04_knowledge_base/Blackwell | 1 |
| 02_companies/SPIL | 1 |
| 04_knowledge_base/AI Accelerator | 1 |
| 02_companies/AMD | 1 |
| 04_knowledge_base/Scale-up networking | 1 |
| 04_knowledge_base/ASIC | 1 |
| 03_industries/US electricity grid | 1 |
| 04_knowledge_base/BF16 | 1 |
| 04_knowledge_base/NVL256 | 1 |
| 04_knowledge_base/Solder Bump | 1 |
| 04_knowledge_base/NIC | 1 |
| 04_knowledge_base/DGX | 1 |
| 04_knowledge_base/HBM2E | 1 |
| 03_industries/Foundry | 1 |
| 04_knowledge_base/光模塊 | 1 |
| 04_knowledge_base/Photoresist | 1 |
| 04_knowledge_base/Power Density | 1 |
| 04_knowledge_base/Rack-scale architecture | 1 |
| 04_knowledge_base/NVIDIA B200 | 1 |
| 04_knowledge_base/200G | 1 |