| 04_knowledge_base/EUV | 36 |
| 02_companies/INTC | 29 |
| 02_companies/2330 台積電 | 15 |
| 02_companies/ASML | 13 |
| 04_knowledge_base/PMMA | 12 |
| 04_knowledge_base/Intel 14A process node | 11 |
| 04_knowledge_base/微影製程 | 8 |
| 04_knowledge_base/Self-assembly | 8 |
| 04_knowledge_base/Underlayer | 6 |
| 04_knowledge_base/Photoresist | 5 |
| 04_knowledge_base/Multi-Patterning | 5 |
| 03_industries/Foundry | 5 |
| 04_knowledge_base/Intel 18A | 3 |
| 04_knowledge_base/DUV | 3 |
| 02_companies/Aligned Data Centers | 3 |
| 04_knowledge_base/DRAM | 3 |
| 04_knowledge_base/Sculpta | 3 |
| 04_knowledge_base/Double Patterning | 3 |
| 04_knowledge_base/Transistor | 3 |
| 04_knowledge_base/Critical dimension | 3 |
| 04_knowledge_base/Design Rule | 3 |
| 04_knowledge_base/2nm | 3 |
| 02_companies/Applied Materials | 2 |
| 02_companies/Together AI | 2 |
| 02_companies/LRCX | 2 |
| 04_knowledge_base/Block Copolymer | 2 |
| 04_knowledge_base/Contact | 2 |
| 04_knowledge_base/Dry Etch | 2 |
| 04_knowledge_base/Via | 2 |
| 04_knowledge_base/Semiconductor Fab | 2 |
| 04_knowledge_base/Overlay | 2 |
| 04_knowledge_base/Directed Self-Assembly | 2 |
| 04_knowledge_base/Electronic Design Automation | 1 |
| 04_knowledge_base/Line-edge roughness | 1 |
| 04_knowledge_base/基板 | 1 |
| 04_knowledge_base/AI Accelerator | 1 |
| 02_companies/6501.T | 1 |
| 02_companies/SONY | 1 |
| 04_knowledge_base/5nm | 1 |
| 04_knowledge_base/Numerical Aperture | 1 |
| 04_knowledge_base/High Volume Manufacturing | 1 |
| 04_knowledge_base/High Aspect Ratio | 1 |
| 04_knowledge_base/Reticle | 1 |
| 04_knowledge_base/SoC | 1 |
| 04_knowledge_base/Pattern Collapse | 1 |
| 04_knowledge_base/Capacitor | 1 |
| 04_knowledge_base/Line Space | 1 |
| 04_knowledge_base/矽晶圓 | 1 |