2023-10-24_wafer-wars-deciphering-latest-restrictions

Canonical Target Counts

TargetOccurrences
02_companies/LRCX14
02_companies/ASML11
04_knowledge_base/Semiconductor Fab9
04_knowledge_base/Overlay9
04_knowledge_base/SiGe8
02_companies/NVDA8
04_knowledge_base/微影製程7
02_companies/CXMT7
04_knowledge_base/DRAM7
02_companies/SMIC6
04_knowledge_base/DUV5
04_knowledge_base/HBM5
04_knowledge_base/GPU5
04_knowledge_base/7nm5
02_companies/INTC4
04_knowledge_base/EUV4
02_companies/Huawei4
04_knowledge_base/Deposition4
02_companies/TXN3
02_companies/AVGO3
04_knowledge_base/Pellicle3
04_knowledge_base/5nm3
04_knowledge_base/Dry Etch3
04_knowledge_base/A8003
04_knowledge_base/NVIDIA H8003
02_companies/AMD2
02_companies/MU2
02_companies/Applied Materials2
02_companies/6525.T2
02_companies/7735.T2
04_knowledge_base/Huawei Ascend2
04_knowledge_base/NAND Flash2
02_companies/2330 台積電2
04_knowledge_base/ASIC2
04_knowledge_base/TOPS2
04_knowledge_base/TFLOPS2
04_knowledge_base/Etching2
04_knowledge_base/A1002
04_knowledge_base/MI3001
02_companies/KLAC1
02_companies/GOOG1
02_companies/MCHP1
04_knowledge_base/CoWoS1
04_knowledge_base/TSV1
04_knowledge_base/Chiplet architecture1
04_knowledge_base/SAQP1
04_knowledge_base/AI Accelerator1
02_companies/YMTC1
02_companies/NXP1
04_knowledge_base/H1001
02_companies/ADI1
02_companies/Tower Semiconductor1
02_companies/Together AI1
04_knowledge_base/Tungsten1
02_companies/STM1
04_knowledge_base/Hybrid Bonding1
02_companies/0006601
04_knowledge_base/Microsoft Cobalt1
04_knowledge_base/FP81
04_knowledge_base/Molybdenum1
04_knowledge_base/AMD Instinct MI250X1
04_knowledge_base/Atomic Layer Deposition1
04_knowledge_base/Intel Gaudi 21
04_knowledge_base/L401
04_knowledge_base/Multi-Patterning1
04_knowledge_base/NVIDIA V1001
03_industries/Foundry1
04_knowledge_base/Transistor1
04_knowledge_base/Interconnect Stack1
04_knowledge_base/Process node1
04_knowledge_base/Compute-in-Memory1
04_knowledge_base/TPU1
04_knowledge_base/NVIDIA L40S1
04_knowledge_base/FP161
04_knowledge_base/14nm1