2023-10-15_going-vertical-gate-all-around-3d

Canonical Target Counts

TargetOccurrences
04_knowledge_base/Deposition47
04_knowledge_base/NAND Flash35
04_knowledge_base/矽晶圓22
04_knowledge_base/DRAM20
04_knowledge_base/Batch ALD17
04_knowledge_base/High Aspect Ratio15
04_knowledge_base/Chemical Vapor Deposition (CVD)13
04_knowledge_base/Capacitor11
02_companies/6525.T10
02_companies/LRCX10
04_knowledge_base/Gate-All-Around10
04_knowledge_base/CFET7
02_companies/Applied Materials7
04_knowledge_base/Aspect Ratio7
04_knowledge_base/Transistor7
04_knowledge_base/Channel Hole6
04_knowledge_base/3D DRAM5
04_knowledge_base/FinFET5
03_industries/Foundry5
02_companies/ASM4
04_knowledge_base/Memory Cell4
04_knowledge_base/HKMG4
04_knowledge_base/Semiconductor Fab4
02_companies/INTC3
04_knowledge_base/Copper3
02_companies/6501.T3
04_knowledge_base/PVD3
02_companies/2330 台積電3
04_knowledge_base/Interconnect Stack3
04_knowledge_base/Charge Trap3
04_knowledge_base/Tungsten2
04_knowledge_base/微影製程2
04_knowledge_base/HBM2
02_companies/EV Group2
04_knowledge_base/SiGe2
04_knowledge_base/基板2
04_knowledge_base/Nanosheet2
04_knowledge_base/Semiconductor manufacturing2
04_knowledge_base/Single-Wafer ALD2
04_knowledge_base/Atomic Layer Deposition2
04_knowledge_base/Electrochemical Deposition2
04_knowledge_base/2nm2
04_knowledge_base/3nm2
02_companies/NVDA1
02_companies/imec1
02_companies/Together AI1
04_knowledge_base/EUV1
02_companies/7735.T1
02_companies/CXMT1
02_companies/AMD1
02_companies/ASML1
04_knowledge_base/Gate Oxide1
04_knowledge_base/Via1
04_knowledge_base/Thin-film deposition1
04_knowledge_base/Contact1
04_knowledge_base/Hard Mask1
04_knowledge_base/Backside Power Delivery1
04_knowledge_base/PECVD1
04_knowledge_base/Wordline1
04_knowledge_base/CMOS1
04_knowledge_base/FET1
04_knowledge_base/Bitline1
04_knowledge_base/Etching1
04_knowledge_base/Shallow Trench Isolation1