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| 02_companies/LRCX | 28 |
| 02_companies/Kioxia | 23 |
| 02_companies/MU | 15 |
| 04_knowledge_base/Deposition | 11 |
| 04_knowledge_base/Cryo etch | 10 |
| 02_companies/YMTC | 9 |
| 04_knowledge_base/Channel Hole | 9 |
| 04_knowledge_base/High Aspect Ratio | 9 |
| 04_knowledge_base/Quad-Level Cell | 7 |
| 04_knowledge_base/Triple-Level Cell | 7 |
| 04_knowledge_base/Etching | 7 |
| 04_knowledge_base/Tungsten | 5 |
| 02_companies/000660 | 5 |
| 04_knowledge_base/DRAM | 5 |
| 04_knowledge_base/Memory Cell | 5 |
| 04_knowledge_base/CMOS | 5 |
| 04_knowledge_base/3D DRAM | 3 |
| 04_knowledge_base/Hybrid Bonding | 3 |
| 04_knowledge_base/微影製程 | 3 |
| 04_knowledge_base/Semiconductor Fab | 3 |
| 02_companies/ASML | 2 |
| 04_knowledge_base/基板 | 2 |
| 04_knowledge_base/Wordline | 2 |
| 04_knowledge_base/Charge Trap | 2 |
| 04_knowledge_base/Critical dimension | 2 |
| 04_knowledge_base/HDD | 2 |
| 04_knowledge_base/SSD | 2 |
| 04_knowledge_base/Flash memory | 1 |
| 04_knowledge_base/Single-Level Cell | 1 |
| 04_knowledge_base/Multi-level cell (MLC) | 1 |
| 04_knowledge_base/Molybdenum | 1 |
| 02_companies/002371.SZ | 1 |
| 02_companies/INTC | 1 |
| 04_knowledge_base/Chemical Vapor Deposition (CVD) | 1 |
| 04_knowledge_base/Moore’s Law | 1 |
| 04_knowledge_base/Memory Channel | 1 |
| 04_knowledge_base/矽晶圓 | 1 |
| 04_knowledge_base/Bitline | 1 |
| 04_knowledge_base/Peripheral Circuit | 1 |
| 04_knowledge_base/CMOS Under Array | 1 |
| 04_knowledge_base/Xtacking | 1 |
| 04_knowledge_base/Contact | 1 |
| 03_industries/WFE | 1 |
| 04_knowledge_base/Floating Gate | 1 |
| 04_knowledge_base/Logic Process | 1 |
| 04_knowledge_base/Hard Mask | 1 |