2023-01-29_the-gaps-in-the-new-china-lithography
Canonical Target Counts
| Target | Occurrences |
|---|
| 04_knowledge_base/微影製程 | 31 |
| 04_knowledge_base/DUV | 12 |
| 02_companies/ASML | 12 |
| 04_knowledge_base/7nm | 12 |
| 04_knowledge_base/ArFi | 10 |
| 02_companies/2330 台積電 | 9 |
| 04_knowledge_base/Overlay | 8 |
| 04_knowledge_base/SAQP | 7 |
| 04_knowledge_base/Photoresist | 7 |
| 04_knowledge_base/Metal pitch | 7 |
| 04_knowledge_base/5nm | 7 |
| 04_knowledge_base/EUV | 6 |
| 04_knowledge_base/14nm | 6 |
| 02_companies/SMIC | 5 |
| 04_knowledge_base/Feature Size | 5 |
| 02_companies/Aligned Data Centers | 4 |
| 04_knowledge_base/Semiconductor manufacturing | 3 |
| 02_companies/Shanghai Micro Electronics Equipment | 3 |
| 04_knowledge_base/28nm | 3 |
| 02_companies/INTC | 2 |
| 03_industries/Foundry | 2 |
| 02_companies/ASM | 1 |
| 02_companies/KLAC | 1 |
| 02_companies/CXMT | 1 |
| 02_companies/Applied Materials | 1 |
| 04_knowledge_base/CMP | 1 |
| 04_knowledge_base/Ion Implantation | 1 |
| 02_companies/YMTC | 1 |
| 02_companies/LRCX | 1 |
| 04_knowledge_base/Rayleigh Criterion | 1 |
| 04_knowledge_base/k1 factor | 1 |
| 04_knowledge_base/Deposition | 1 |
| 04_knowledge_base/Process node | 1 |
| 04_knowledge_base/Chemical Supply Chain | 1 |
| 04_knowledge_base/Numerical Aperture | 1 |
| 04_knowledge_base/Leading-Edge Node | 1 |
| 04_knowledge_base/Critical dimension | 1 |
| 04_knowledge_base/矽晶圓 | 1 |