2022-11-30_lithography-intensity-and-long-term
Canonical Target Counts
| Target | Occurrences |
|---|
| 02_companies/ASML | 24 |
| 04_knowledge_base/微影製程 | 20 |
| 04_knowledge_base/DRAM | 11 |
| 04_knowledge_base/EUV | 10 |
| 04_knowledge_base/NAND Flash | 6 |
| 04_knowledge_base/3D DRAM | 6 |
| 04_knowledge_base/矽晶圓 | 5 |
| 03_industries/Foundry | 4 |
| 02_companies/Shanghai Micro Electronics Equipment | 3 |
| 04_knowledge_base/5nm | 3 |
| 04_knowledge_base/Semiconductor Fab | 3 |
| 04_knowledge_base/TSMC N3E | 2 |
| 02_companies/MU | 2 |
| 04_knowledge_base/SAQP | 2 |
| 04_knowledge_base/Installed Capacity | 2 |
| 04_knowledge_base/Capacitor | 2 |
| 04_knowledge_base/2nm | 2 |
| 04_knowledge_base/ArFi | 2 |
| 04_knowledge_base/Nanosheet | 1 |
| 04_knowledge_base/CFET | 1 |
| 04_knowledge_base/TSMC N3 | 1 |
| 04_knowledge_base/DUV | 1 |
| 02_companies/2330 台積電 | 1 |
| 04_knowledge_base/DTCO | 1 |
| 04_knowledge_base/7nm | 1 |
| 04_knowledge_base/CMOS | 1 |
| 04_knowledge_base/Multi-Patterning | 1 |
| 04_knowledge_base/Process node | 1 |
| 04_knowledge_base/Via | 1 |
| 04_knowledge_base/Deposition | 1 |
| 04_knowledge_base/Hard Mask | 1 |
| 04_knowledge_base/Contact | 1 |
| 04_knowledge_base/Dry Etch | 1 |
| 04_knowledge_base/Wafer Pricing | 1 |
| 04_knowledge_base/3nm | 1 |