2022-11-01_the-future-of-packaging-gets-blurry
Canonical Target Counts
| Target | Occurrences |
|---|
| 04_knowledge_base/ABF | 22 |
| 04_knowledge_base/RDL | 20 |
| 04_knowledge_base/基板 | 19 |
| 04_knowledge_base/封裝 | 18 |
| 02_companies/MU | 9 |
| 04_knowledge_base/GPU | 6 |
| 04_knowledge_base/HBM | 6 |
| 02_companies/INTC | 6 |
| 02_companies/2330 台積電 | 5 |
| 04_knowledge_base/Silicon bridge | 5 |
| 02_companies/SPIL | 4 |
| 02_companies/CSCO | 4 |
| 02_companies/AMD | 4 |
| 02_companies/3037 欣興 | 3 |
| 04_knowledge_base/Interposer | 3 |
| 04_knowledge_base/SoIC | 2 |
| 02_companies/AAPL | 2 |
| 04_knowledge_base/Thermal Compression Bonding | 2 |
| 02_companies/AMKR | 2 |
| 04_knowledge_base/Copper | 2 |
| 04_knowledge_base/Known Good Die | 2 |
| 04_knowledge_base/AMD Instinct MI250X | 2 |
| 02_companies/MediaTek | 1 |
| 02_companies/NVDA | 1 |
| 04_knowledge_base/Foveros | 1 |
| 04_knowledge_base/Heterogeneous integration | 1 |
| 04_knowledge_base/Organic interposer | 1 |
| 04_knowledge_base/FoCoS | 1 |
| 04_knowledge_base/InFO | 1 |
| 04_knowledge_base/CoWoS | 1 |
| 04_knowledge_base/Chip-on-Wafer | 1 |
| 04_knowledge_base/RDNA 3 | 1 |
| 04_knowledge_base/SoC | 1 |
| 04_knowledge_base/CPU | 1 |
| 04_knowledge_base/Hybrid substrate | 1 |
| 04_knowledge_base/Reticle | 1 |
| 04_knowledge_base/Coefficient of Thermal Expansion | 1 |
| 04_knowledge_base/Line Space | 1 |
| 04_knowledge_base/Warpage | 1 |
| 04_knowledge_base/3D V-Cache | 1 |
| 04_knowledge_base/Meteor Lake | 1 |
| 04_knowledge_base/ASIC | 1 |