2022-08-12_2022-nand-process-technology-comparison
Canonical Target Counts
| Target | Occurrences |
|---|
| 04_knowledge_base/NAND Flash | 91 |
| 02_companies/000660 | 29 |
| 02_companies/YMTC | 25 |
| 04_knowledge_base/Semiconductor Fab | 21 |
| 02_companies/MU | 20 |
| 02_companies/Kioxia | 19 |
| 04_knowledge_base/DRAM | 13 |
| 04_knowledge_base/Triple-Level Cell | 13 |
| 04_knowledge_base/Quad-Level Cell | 9 |
| 02_companies/INTC | 8 |
| 04_knowledge_base/Charge Trap | 7 |
| 02_companies/LRCX | 5 |
| 04_knowledge_base/Floating Gate | 5 |
| 04_knowledge_base/Flash memory | 4 |
| 04_knowledge_base/CMOS | 4 |
| 04_knowledge_base/SSD | 4 |
| 04_knowledge_base/Xtacking | 4 |
| 04_knowledge_base/Process node | 3 |
| 04_knowledge_base/HDD | 3 |
| 02_companies/SMIC | 2 |
| 04_knowledge_base/Hybrid Bonding | 2 |
| 04_knowledge_base/Multi-level cell (MLC) | 2 |
| 02_companies/SanDisk | 2 |
| 04_knowledge_base/7nm | 2 |
| 04_knowledge_base/Deposition | 2 |
| 04_knowledge_base/CXL | 1 |
| 02_companies/2330 台積電 | 1 |
| 04_knowledge_base/EUV | 1 |
| 04_knowledge_base/CMP | 1 |
| 04_knowledge_base/Single-Level Cell | 1 |
| 04_knowledge_base/ARM Phoenix CPU | 1 |
| 04_knowledge_base/PCIe | 1 |
| 04_knowledge_base/Semiconductor manufacturing | 1 |
| 03_industries/記憶體產業 | 1 |
| 04_knowledge_base/Moore’s Law | 1 |
| 02_companies/Together AI | 1 |
| 04_knowledge_base/High Aspect Ratio | 1 |
| 04_knowledge_base/14nm | 1 |
| 04_knowledge_base/CMOS Under Array | 1 |
| 04_knowledge_base/3D XPoint | 1 |
| 04_knowledge_base/Photoresist | 1 |
| 04_knowledge_base/Bitline | 1 |
| 04_knowledge_base/Wafer bonding | 1 |
| 04_knowledge_base/矽晶圓 | 1 |
| 03_industries/Foundry | 1 |