2022-07-19_disco-corporation-the-world-leader
Canonical Target Counts
| Target | Occurrences |
|---|
| 04_knowledge_base/Dicing | 8 |
| 04_knowledge_base/封裝 | 6 |
| 04_knowledge_base/矽晶圓 | 4 |
| 04_knowledge_base/Stealth Dicing | 4 |
| 02_companies/MU | 2 |
| 04_knowledge_base/Silicon carbide | 2 |
| 02_companies/Applied Materials | 2 |
| 03_industries/OSAT產業 | 2 |
| 04_knowledge_base/MEMS | 2 |
| 04_knowledge_base/Dicing Saw | 2 |
| 04_knowledge_base/Power Semiconductor | 2 |
| 03_industries/WFE | 2 |
| 02_companies/CARR | 1 |
| 04_knowledge_base/Hybrid Bonding | 1 |
| 02_companies/6361.T | 1 |
| 04_knowledge_base/探針卡 | 1 |
| 02_companies/KLAC | 1 |
| 04_knowledge_base/CMP | 1 |
| 04_knowledge_base/基板 | 1 |
| 02_companies/LRCX | 1 |
| 02_companies/Apollo Global Management | 1 |
| 02_companies/ASML | 1 |
| 04_knowledge_base/Silicon photonics | 1 |
| 04_knowledge_base/Via | 1 |
| 04_knowledge_base/3nm | 1 |
| 04_knowledge_base/DAD-2H | 1 |
| 04_knowledge_base/Plasma dicing | 1 |
| 04_knowledge_base/Dicing Before Grinding | 1 |
| 04_knowledge_base/Grinding Wheel | 1 |
| 04_knowledge_base/Taiko Process | 1 |
| 04_knowledge_base/Metallization | 1 |