2022-06-19_die-size-and-reticle-conundrum-cost
Canonical Target Counts
| Target | Occurrences |
|---|
| 04_knowledge_base/Chiplet architecture | 19 |
| 04_knowledge_base/Reticle | 18 |
| 04_knowledge_base/微影製程 | 15 |
| 03_industries/Foundry | 8 |
| 04_knowledge_base/EUV | 7 |
| 04_knowledge_base/Photomask | 6 |
| 02_companies/ASML | 4 |
| 04_knowledge_base/DUV | 4 |
| 04_knowledge_base/矽晶圓 | 4 |
| 04_knowledge_base/5nm | 4 |
| 04_knowledge_base/封裝 | 3 |
| 02_companies/AMD | 2 |
| 04_knowledge_base/Datacenter CPU | 2 |
| 04_knowledge_base/Semiconductor Fab | 2 |
| 04_knowledge_base/Gate-All-Around | 2 |
| 02_companies/LRCX | 1 |
| 04_knowledge_base/Nanosheet | 1 |
| 02_companies/Applied Materials | 1 |
| 04_knowledge_base/Yield Harvesting | 1 |
| 02_companies/INTC | 1 |
| 04_knowledge_base/2nm | 1 |
| 04_knowledge_base/Process node | 1 |
| 04_knowledge_base/3nm | 1 |
| 04_knowledge_base/CPU | 1 |
| 04_knowledge_base/FinFET | 1 |
| 04_knowledge_base/300mm Wafer | 1 |
| 04_knowledge_base/28nm | 1 |
| 04_knowledge_base/Deposition | 1 |