2022-02-10_semiconductor-roundup-2102022

Canonical Target Counts

TargetOccurrences
02_companies/GlobalFoundries12
02_companies/QCOM10
02_companies/Renesas8
02_companies/Amazon7
02_companies/Ford6
04_knowledge_base/DRAM6
02_companies/Rambus6
02_companies/2330 台積電6
04_knowledge_base/Semiconductor Fab5
02_companies/AMD4
04_knowledge_base/Silicon photonics4
02_companies/LRCX4
04_knowledge_base/AWS4
04_knowledge_base/RF Front-End4
04_knowledge_base/AMD EPYC Genoa3
04_knowledge_base/CXL3
04_knowledge_base/基板3
02_companies/TXN3
03_industries/Foundry3
04_knowledge_base/矽晶圓3
02_companies/MediaTek2
02_companies/INTC2
02_companies/AAPL2
02_companies/TSLA2
02_companies/Entegris2
04_knowledge_base/AMD EPYC Milan2
04_knowledge_base/NAND Flash2
02_companies/FormFactor2
04_knowledge_base/Silicon carbide2
04_knowledge_base/探針卡2
04_knowledge_base/CPU2
04_knowledge_base/Wire bonder2
04_knowledge_base/ultraBAW2
02_companies/Fabrinet1
02_companies/STM1
04_knowledge_base/SoC1
02_companies/Teradyne1
02_companies/Wolfspeed1
04_knowledge_base/Hybrid Bonding1
04_knowledge_base/CPO1
02_companies/KLAC1
02_companies/GOOG1
04_knowledge_base/Thermal Compression Bonding1
04_knowledge_base/Chiplet architecture1
02_companies/CATL1
04_knowledge_base/SiGe1
04_knowledge_base/MLCC1
02_companies/BYD1
02_companies/Synaptics1
02_companies/MCHP1
02_companies/0006601
04_knowledge_base/AI Accelerator1
02_companies/Xilinx1
04_knowledge_base/SiC MOSFET1
02_companies/67521
02_companies/AVGO1
04_knowledge_base/Nitro1
02_companies/MU1
04_knowledge_base/Heterogeneous integration1
04_knowledge_base/SSD1
04_knowledge_base/CMOS1
04_knowledge_base/Wi-Fi 6E1
04_knowledge_base/High Voltage1
04_knowledge_base/RF-SOI1
04_knowledge_base/Clean Room1
04_knowledge_base/InnoSwitch1
04_knowledge_base/Wi-Fi 71
04_knowledge_base/DIMM1
04_knowledge_base/Mini-LED1
04_knowledge_base/Memory Pooling1
04_knowledge_base/mmWave Antenna1