2022-01-28_semiconductor-roundup-1282022
Canonical Target Counts
| Target | Occurrences |
|---|
| 02_companies/AAPL | 10 |
| 02_companies/KLAC | 9 |
| 02_companies/TSLA | 9 |
| 04_knowledge_base/Silicon carbide | 8 |
| 02_companies/STM | 8 |
| 02_companies/2330 台積電 | 6 |
| 04_knowledge_base/PCIe | 3 |
| 02_companies/LRCX | 3 |
| 02_companies/INTC | 3 |
| 04_knowledge_base/NAND Flash | 3 |
| 04_knowledge_base/SSD | 3 |
| 04_knowledge_base/矽晶圓 | 2 |
| 04_knowledge_base/Semiconductor Fab | 2 |
| 03_industries/WFE | 2 |
| 02_companies/Ford | 1 |
| 04_knowledge_base/微影製程 | 1 |
| 02_companies/TXN | 1 |
| 04_knowledge_base/PAM4 | 1 |
| 04_knowledge_base/Digital Signal Processor | 1 |
| 04_knowledge_base/NRZ | 1 |
| 02_companies/MediaTek | 1 |
| 04_knowledge_base/DRAM | 1 |
| 02_companies/Wolfspeed | 1 |
| 04_knowledge_base/Electrical Integrated Circuit (EIC) | 1 |
| 02_companies/000660 | 1 |
| 02_companies/Teradyne | 1 |
| 04_knowledge_base/Silicon photonics | 1 |
| 04_knowledge_base/ASIC | 1 |
| 02_companies/Xilinx | 1 |
| 02_companies/Together AI | 1 |
| 04_knowledge_base/400G | 1 |
| 04_knowledge_base/Atomic Layer Deposition | 1 |
| 03_industries/Foundry | 1 |
| 04_knowledge_base/TIA | 1 |
| 04_knowledge_base/28nm | 1 |
| 04_knowledge_base/5nm | 1 |
| 04_knowledge_base/Deposition | 1 |
| 04_knowledge_base/BGA | 1 |
| 04_knowledge_base/UFS | 1 |