2022-01-19_advanced-packaging-part-3-intels
Canonical Target Counts
| Target | Occurrences |
|---|
| 04_knowledge_base/Thermal Compression Bonding | 45 |
| 02_companies/INTC | 27 |
| 04_knowledge_base/封裝 | 26 |
| 04_knowledge_base/HBM | 14 |
| 04_knowledge_base/Flip-chip | 12 |
| 02_companies/MU | 8 |
| 02_companies/2330 台積電 | 7 |
| 04_knowledge_base/Hybrid Bonding | 6 |
| 04_knowledge_base/Copper | 4 |
| 02_companies/ASM | 4 |
| 04_knowledge_base/基板 | 4 |
| 04_knowledge_base/Interposer | 3 |
| 04_knowledge_base/Foveros | 3 |
| 04_knowledge_base/CPO | 3 |
| 04_knowledge_base/DRAM | 3 |
| 04_knowledge_base/Reflow oven | 3 |
| 02_companies/Huawei | 2 |
| 04_knowledge_base/InFO | 2 |
| 04_knowledge_base/Warpage | 2 |
| 04_knowledge_base/Underfill | 2 |
| 04_knowledge_base/Meteor Lake | 2 |
| 04_knowledge_base/Sapphire Rapids | 1 |
| 04_knowledge_base/Die-to-die interconnect | 1 |
| 04_knowledge_base/Datacenter CPU | 1 |
| 04_knowledge_base/導電漿 | 1 |
| 04_knowledge_base/RDL | 1 |
| 04_knowledge_base/AI Accelerator | 1 |
| 02_companies/AMKR | 1 |
| 04_knowledge_base/CMP | 1 |
| 02_companies/QCOM | 1 |
| 03_industries/OSAT產業 | 1 |
| 02_companies/CARR | 1 |
| 04_knowledge_base/ABF | 1 |
| 02_companies/EV Group | 1 |
| 02_companies/AMD | 1 |
| 04_knowledge_base/HBM3 | 1 |
| 02_companies/SPIL | 1 |
| 02_companies/NVDA | 1 |
| 04_knowledge_base/Solder Bump | 1 |
| 03_industries/Foundry | 1 |
| 04_knowledge_base/Contact | 1 |
| 04_knowledge_base/Bump pitch | 1 |
| 04_knowledge_base/SoC | 1 |
| 04_knowledge_base/GPU | 1 |
| 04_knowledge_base/Coefficient of Thermal Expansion | 1 |
| 04_knowledge_base/Surface Activation | 1 |
| 04_knowledge_base/Process node | 1 |
| 04_knowledge_base/Wire bonder | 1 |