2021-12-22_tsmc-the-drug-dealer-is-trying-to
Canonical Target Counts
| Target | Occurrences |
|---|
| 02_companies/2330 台積電 | 71 |
| 02_companies/INTC | 42 |
| 02_companies/AAPL | 24 |
| 04_knowledge_base/GPU | 19 |
| 02_companies/NVDA | 17 |
| 02_companies/QCOM | 14 |
| 02_companies/MediaTek | 13 |
| 02_companies/AMD | 13 |
| 03_industries/Foundry | 13 |
| 02_companies/AVGO | 12 |
| 04_knowledge_base/CPU | 12 |
| 04_knowledge_base/Chiplet architecture | 11 |
| 04_knowledge_base/封裝 | 9 |
| 04_knowledge_base/Process node | 8 |
| 04_knowledge_base/SoC | 6 |
| 04_knowledge_base/矽晶圓 | 6 |
| 04_knowledge_base/Granite Rapids | 5 |
| 04_knowledge_base/RF Front-End | 4 |
| 04_knowledge_base/Meteor Lake | 4 |
| 04_knowledge_base/Intel Diamond Rapids | 2 |
| 04_knowledge_base/PDK | 2 |
| 04_knowledge_base/Datacenter CPU | 2 |
| 04_knowledge_base/TSMC N3 | 2 |
| 04_knowledge_base/Graviton3 | 2 |
| 04_knowledge_base/InFO | 1 |
| 04_knowledge_base/PMIC | 1 |
| 02_companies/0522.HK | 1 |
| 04_knowledge_base/Hopper | 1 |
| 04_knowledge_base/Network on Chip | 1 |
| 02_companies/Together AI | 1 |
| 04_knowledge_base/Hybrid Bonding | 1 |
| 04_knowledge_base/Interposer | 1 |
| 04_knowledge_base/PCIe | 1 |
| 02_companies/Amazon | 1 |
| 04_knowledge_base/Foveros | 1 |
| 04_knowledge_base/基板 | 1 |
| 04_knowledge_base/BMC | 1 |
| 04_knowledge_base/IP block | 1 |
| 04_knowledge_base/DDR | 1 |
| 04_knowledge_base/Reticle | 1 |
| 04_knowledge_base/Intel Ponte Vecchio | 1 |
| 04_knowledge_base/Transistor | 1 |
| 04_knowledge_base/Thermal Compression Bonding | 1 |
| 04_knowledge_base/Sierra Forest | 1 |