2021-10-14_tsmc-3nm-wafer-shipments-pushed-into
Canonical Target Counts
| Target | Occurrences |
|---|
| 02_companies/2330 台積電 | 37 |
| 04_knowledge_base/Semiconductor Fab | 9 |
| 02_companies/AAPL | 6 |
| 04_knowledge_base/TSMC N3E | 5 |
| 04_knowledge_base/矽晶圓 | 5 |
| 02_companies/INTC | 3 |
| 04_knowledge_base/EUV | 3 |
| 04_knowledge_base/TSMC N3 | 3 |
| 02_companies/Renesas | 2 |
| 02_companies/SONY | 2 |
| 02_companies/MediaTek | 2 |
| 04_knowledge_base/Transistor | 2 |
| 04_knowledge_base/2nm | 2 |
| 04_knowledge_base/High Volume Manufacturing | 2 |
| 04_knowledge_base/Cost per Transistor | 2 |
| 04_knowledge_base/3nm | 2 |
| 02_companies/Huawei | 1 |
| 02_companies/Marvell | 1 |
| 02_companies/QCOM | 1 |
| 02_companies/AMD | 1 |
| 02_companies/NVDA | 1 |
| 04_knowledge_base/微影製程 | 1 |
| 02_companies/Together AI | 1 |
| 04_knowledge_base/Defect Density | 1 |
| 04_knowledge_base/Design Rule | 1 |
| 03_industries/WFE | 1 |
| 03_industries/Foundry | 1 |
| 04_knowledge_base/CMOS | 1 |
| 04_knowledge_base/28nm | 1 |
| 04_knowledge_base/Interconnect Stack | 1 |