2021-09-29_aehr-multi-wafer-level-burn-in-test
Canonical Target Counts
| Target | Occurrences |
|---|
| 04_knowledge_base/Silicon carbide | 11 |
| 04_knowledge_base/Burn-in | 9 |
| 04_knowledge_base/矽晶圓 | 6 |
| 04_knowledge_base/FOX-XP | 6 |
| 02_companies/INTC | 5 |
| 04_knowledge_base/PIC | 4 |
| 04_knowledge_base/WaferPak | 4 |
| 04_knowledge_base/Silicon photonics | 3 |
| 04_knowledge_base/800G | 3 |
| 04_knowledge_base/探針卡 | 3 |
| 04_knowledge_base/400G | 3 |
| 02_companies/KLAC | 2 |
| 02_companies/FormFactor | 2 |
| 04_knowledge_base/封裝 | 2 |
| 02_companies/Advantest | 2 |
| 04_knowledge_base/WaferPak Aligner | 2 |
| 04_knowledge_base/Semiconductor manufacturing | 1 |
| 04_knowledge_base/Semiconductor Chip Binning | 1 |
| 02_companies/TER | 1 |
| 04_knowledge_base/ATE | 1 |
| 02_companies/ON Semiconductor | 1 |
| 04_knowledge_base/VCSEL | 1 |
| 04_knowledge_base/LiDAR | 1 |
| 04_knowledge_base/DPS channel | 1 |
| 04_knowledge_base/Indium Phosphide Laser | 1 |
| 04_knowledge_base/Contact | 1 |
| 04_knowledge_base/FOX Die-Pack Carrier | 1 |